Neese; Wayne E.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Neese; Wayne E..The latest application filed is for "fastener and receptacle arrangement for perpendicularly connecting pieces of flat stock material".
- Neese; Wayne E. - Hoffman Estates IL
| Patent | Date |
|---|---|
| Fastener and receptacle arrangement for perpendicularly connecting pieces of flat stock material Grant 4,657,423 - Neese , et al. April 14, 1 | 1987-04-14 |
| High density multi-layer circuit arrangement Grant 4,598,166 - Neese July 1, 1 | 1986-07-01 |
| Thick film screen printing apparatus Grant 4,549,484 - Neese October 29, 1 | 1985-10-29 |
| Electrical switch for thick/thin film circuits Grant 4,454,396 - Neese June 12, 1 | 1984-06-12 |
| Arrangement for mounting dual-in-line packaged integrated circuits to thick/thin film circuits Grant 4,272,140 - Lychyk , et al. June 9, 1 | 1981-06-09 |
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