Ned; Alexander

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ned; Alexander.The latest application filed is for "high-temperature headers for sensing elements".

Company Profile

2.15.6

Ned; Alexander - Kinnelon NJ
Ned; Alexander - Bloomingdale NJ
Ned; Alexander - Wayne NJ

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
High-temperature headers for sensing elements Grant 10,605,685 - Ned , et al.	2020-03-31
High-temperature Headers For Sensing Elements App 20190033155 - Ned; Alexander ; et al.	2019-01-31
High-temperature headers for sensing elements Grant 10,119,877 - Ned , et al. November 6, 2	2018-11-06
High-temperature Headers For Sensing Elements App 20170016791 - Ned; Alexander ; et al.	2017-01-19
Methods Of Fabricating Silicon-on-insulator (soi) Semiconductor Devices Using Blanket Fusion Bonding App 20140273399 - NED; ALEXANDER ; et al.	2014-09-18
Flat covered leadless pressure sensor assemblies suitable for operation in extreme environments Grant 8,656,784 - Ned , et al. February 25, 2	2014-02-25
Differential temperature and acceleration compensated pressure transducer Grant 8,631,707 - Kurtz , et al. January 21, 2	2014-01-21
Leadless media protected fast response RTD sensor and method for making the same Grant 8,497,759 - Kurtz , et al. July 30, 2	2013-07-30
Method and apparatus for preventing catastrophic contact failure in ultra high temperature piezoresistive sensors and transducers Grant 8,497,757 - Kurtz , et al. July 30, 2	2013-07-30
Flat Covered Leadless Pressure Sensor Assemblies Suitable For Operation In Extreme Environments App 20130042694 - NED; ALEXANDER ; et al.	2013-02-21
Mounting apparatus and method for accurately positioning and aligning a leadless semiconductor chip on an associated header Grant 7,874,216 - Kurtz , et al. January 25, 2	2011-01-25
Mounting apparatus and method for accurately positioning and aligning a leadless semiconductor chip on an associated header App 20090313797 - Kurtz; Anthony D. ; et al.	2009-12-24
Hermetically sealed transducer and methods for producing the same Grant 6,326,682 - Kurtz , et al. December 4, 2	2001-12-04
Ultra thin surface mount wafer sensor structures and methods for fabricating same Grant 6,210,989 - Kurtz , et al. April 3, 2	2001-04-03
Ultra thin surface mount wafer sensor structures and methods for fabricating same Grant 5,973,590 - Kurtz , et al. October 26, 1	1999-10-26
Hermetically sealed transducers and methods for producing the same Grant 5,891,751 - Kurtz , et al. April 6, 1	1999-04-06

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