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NEC Toppan Circuit Solutions, Inc. Patent Filings

NEC Toppan Circuit Solutions, Inc.

Patent Applications and Registrations

Patent applications and USPTO patent grants for NEC Toppan Circuit Solutions, Inc..The latest application filed is for "sheet-shaped capacitor and method for manufacture thereof".

Company Profile
0.12.7
  • NEC Toppan Circuit Solutions, Inc. - Tokyo JP
  • NEC Toppan Circuit Solutions, INC - Tokyo JP
  • NEC Toppan Circuit Solutions, Inc. - 2-2-7, Yaesu Tokyo JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Sheet-shaped capacitor and method for manufacture thereof
Grant 7,317,610 - Nakamura , et al. January 8, 2
2008-01-08
Board for mounting BGA semiconductor chip thereon, semiconductor device, and methods of fabricating such board and semiconductor device
Grant 7,303,978 - Ito December 4, 2
2007-12-04
Method of inspecting optical waveguide substrate for optical conduction at increased speed and also inspecting optical waveguide substrate for crosstalk
Grant 7,106,426 - Kikuchi , et al. September 12, 2
2006-09-12
Sheet-shaped capacitor and method for manufacture thereof
App 20060120014 - Nakamura; Hirofumi ;   et al.
2006-06-08
Method of manufacturing optical waveguide and method of manufacturing opto-electric wiring board
Grant 6,999,643 - Kikuchi , et al. February 14, 2
2006-02-14
Methods of manufacturing board having throughholes filled with resin and multi-layered printed wiring board using the board
Grant 6,938,336 - Ito , et al. September 6, 2
2005-09-06
Board for mounting BGA semiconductor chip thereon, semiconductor device, and methods of fabricating such board and semiconductor device
App 20050156326 - Ito, Toshihide
2005-07-21
Printed circuit board, method for producing same and semiconductor device
Grant 6,882,544 - Nakamura , et al. April 19, 2
2005-04-19
Printed circuit board, method for producing same and semiconductor device
App 20040246690 - Nakamura, Hirofumi ;   et al.
2004-12-09
Optical waveguide path, manufacturing method and coupling method of the same, and optical waveguide path coupling structure
Grant 6,791,675 - Kikuchi , et al. September 14, 2
2004-09-14
Printed-circuit board, coaxial cable, and electronic device
Grant 6,717,494 - Kikuchi , et al. April 6, 2
2004-04-06
Process for producing printed wiring board
Grant 6,709,803 - Hotta March 23, 2
2004-03-23
Solder, method for processing surface of printed wiring board, and method for mounting electronic part
Grant 6,702,176 - Ito , et al. March 9, 2
2004-03-09
Board for mounting BGA semiconductor chip thereon, semiconductor device, and methods of fabricating such board and semiconductor device
App 20030155638 - Ito, Toshihide
2003-08-21
Optical module and method for manufacturing the same
Grant 6,608,946 - Kikuchi , et al. August 19, 2
2003-08-19
Method of inspecting optical waveguide substrate for optical conduction at increased speed and also inspecting optical waveguide substrate for crosstalk
App 20030117614 - Kikuchi, Hideo ;   et al.
2003-06-26
Custom product order acceptance supporting apparatus
App 20030097311 - Shinohara, Noriko ;   et al.
2003-05-22
Printed circuit board and method for manufacturing same
Grant 6,563,057 - Hotta , et al. May 13, 2
2003-05-13
Methods of manufacturing board having throughholes filled with resin and multi-layered printed wiring board using the board
App 20030074790 - Ito, Toshihide ;   et al.
2003-04-24

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