loadpatents
name:-0.0157630443573
name:-0.016170024871826
name:-0.0033338069915771
NEC SCHOTT Components Corporation Patent Filings

NEC SCHOTT Components Corporation

Patent Applications and Registrations

Patent applications and USPTO patent grants for NEC SCHOTT Components Corporation.The latest application filed is for "hermetic terminal, aluminum electrolytic capacitor, and method for manufacturing aluminum electrolytic capacitor".

Company Profile
0.16.12
  • NEC SCHOTT Components Corporation - Koka-shi N/A JP
  • NEC SCHOTT Components Corporation - Koka-shi, Shiga JP
  • NEC SCHOTT COMPONENTS CORPORATION - Shiga JP
  • NEC Schott Components Corporation - Minakuchi-cho JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Hermetic terminal
Grant D832,794 - Maegawa , et al. November 6, 2
2018-11-06
Hermetic terminal
Grant D832,795 - Maegawa November 6, 2
2018-11-06
Hermetic Terminal, Aluminum Electrolytic Capacitor, and Method for Manufacturing Aluminum Electrolytic Capacitor
App 20180151300 - HONDA; Hiroki ;   et al.
2018-05-31
Temperature fuse and sliding electrode used for temperature fuse
Grant 9,460,883 - Yoshikawa October 4, 2
2016-10-04
Fuse Element for Protection Device and Circuit Protection Device Including the Same
App 20150130585 - Nakajima; Shintaro ;   et al.
2015-05-14
Packaging device and base member for packaging
Grant 8,884,165 - Kamada November 11, 2
2014-11-11
Temperature Fuse and Sliding Electrode Used for Temperature Fuse
App 20140306794 - Yoshikawa; Tokihiro
2014-10-16
High-pressure-resistant hermetic seal terminal and method of manufacturing the same
Grant 8,420,933 - Harada , et al. April 16, 2
2013-04-16
High-Pressure-Resistant Hermetic Seal Terminal and Method of Manufacturing the Same
App 20120018216 - Harada; Hidehiko ;   et al.
2012-01-26
Packaging Device and Base Member for Packaging
App 20110108308 - Kamada; Hiroshi
2011-05-12
Thermal fuse employing thermosensitive pellet
Grant 7,843,307 - Yoshikawa November 30, 2
2010-11-30
Thermistor device
Grant 7,709,922 - Takagi , et al. May 4, 2
2010-05-04
Thermal fuse employing thermosensitive pellet
App 20090179729 - Yoshikawa; Tokihiro
2009-07-16
Protection apparatus
Grant 7,529,072 - Nishikawa May 5, 2
2009-05-05
Thermal fuse employing thermosensitive pellet
App 20090091417 - Yoshikawa; Tokihiro
2009-04-09
Thermal pellet type thermal fuse
Grant 7,362,208 - Yoshikawa , et al. April 22, 2
2008-04-22
Thermal fuse employing a thermosensitive pellet
Grant 7,330,098 - Yoshikawa February 12, 2
2008-02-12
Thermal pellet incorporated thermal fuse and method of producing thermal pellet
Grant 7,323,966 - Yoshikawa January 29, 2
2008-01-29
Thermal fuse using thermosensitive material
Grant 7,323,965 - Yoshikawa January 29, 2
2008-01-29
Protection apparatus
App 20070025042 - Nishikawa; Masahiro
2007-02-01
Thermal fuse employing thermosensitive pellet
App 20060232372 - Yoshikawa; Tokihiro
2006-10-19
Thermal fuse employing thermosensitive pellet
App 20060208845 - Yoshikawa; Tokihiro
2006-09-21
Surface mounting package
Grant 6,977,339 - Fukushima December 20, 2
2005-12-20
Thermal pellet incorporated thermal fuse and method of producing thermal pellet
App 20050088272 - Yoshikawa, Tokihiro
2005-04-28
Thin metal package and manufacturing method thereof
Grant 6,852,927 - Fukushima February 8, 2
2005-02-08
Thermal fuse
Grant 6,724,292 - Miyashita , et al. April 20, 2
2004-04-20

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