Neaves; Jeffrey Eugene

Patent Applications and Registrations

Patent applications and USPTO patent grants for Neaves; Jeffrey Eugene.The latest application filed is for "ejectable component assemblies in electronic devices".

Company Profile

2.8.7

Neaves; Jeffrey Eugene - Cupertino CA
Neaves; Jeffrey Eugene - Duluth GA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Ejectable component assemblies in electronic devices Grant 11,050,865 - Wang , et al. June 29, 2	2021-06-29
Ejectable Component Assemblies In Electronic Devices App 20190230202 - Wang; Erik L. ; et al.	2019-07-25
Ejectable component assemblies in electronic devices Grant 10,277,722 - Wang , et al.	2019-04-30
Electronic device comprising an electronic connector and a flexible printed circuit Grant 9,553,385 - Beck , et al. January 24, 2	2017-01-24
Ejectable Component Assemblies In Electronic Devices App 20170013098 - Wang; Erik L. ; et al.	2017-01-12
Electronic Device Comprising An Electronic Connector And A Flexible Printed Circuit App 20160372851 - BECK; JUSTIN MICHAEL ; et al.	2016-12-22
Ejectable component assemblies in electronic devices Grant 9,504,179 - Wang , et al. November 22, 2	2016-11-22
Ejectable Component Assemblies In Electronic Devices App 20140247567 - Wang; Erik L. ; et al.	2014-09-04
Ejectable component assemblies in electronic devices Grant 8,725,198 - Wang , et al. May 13, 2	2014-05-13
Ejectable Component Assemblies In Electronic Devices App 20120176753 - Wang; Erik L. ; et al.	2012-07-12
Ejectable component assemblies in electronic devices Grant 8,145,261 - Wang , et al. March 27, 2	2012-03-27
Ejectable Component Assemblies In Electronic Devices App 20110080699 - Wang; Erik L. ; et al.	2011-04-07
Ejectable component assemblies in electronic devices Grant 7,865,210 - Wang , et al. January 4, 2	2011-01-04
Ejectable component assemblies in electronic devices App 20080165508 - Wang; Erik L. ; et al.	2008-07-10

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