Nayar; Deepak
Patent Applications and Registrations
Patent applications and USPTO patent grants for Nayar; Deepak.The latest application filed is for "thin film coating packaging for device having meltable and wetting links".
- Nayar; Deepak - Chicago IL
- Nayar; Deepak - Dongguan City CN
- Nayar; Deepak - Hayward CA
| Patent | Date |
|---|---|
| Surface mount fuse with solder link and de-wetting substrate Grant 11,437,212 - Arciaga , et al. September 6, 2 | 2022-09-06 |
| Thin Film Coating Packaging for Device Having Meltable and Wetting Links App 20210388230 - MATUS; YURIY BORISOVICH ; et al. | 2021-12-16 |
| Circuit Protection Apparatus Including Structurally Resilient Electrical Transient Material And Method For Making Same App 20210110953 - Chen; Jianhua ; et al. | 2021-04-15 |
| PTC circuit protection device comprising mechanical stress riser Grant 5,303,115 - Nayar , et al. April 12, 1 | 1994-04-12 |
| SEC | 0001526287 | Nayar Deepak |
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