Nawa; Honami

Patent Applications and Registrations

Patent applications and USPTO patent grants for Nawa; Honami.The latest application filed is for "structure, and electronic component and electronic device including the structure".

Company Profile

1.4.5

Nawa; Honami - Osaka JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Heat-dissipating resin composition, and component and electronic device including the same Grant 10,407,604 - Nawa , et al. Sept	2019-09-10
Resin structure, and electronic component and electronic device using the structure Grant 9,859,190 - Nawa , et al. January 2, 2	2018-01-02
Structure, And Electronic Component And Electronic Device Including The Structure App 20170338166 - NAWA; HONAMI ; et al.	2017-11-23
Resin Structure, And Electronic Component And Electronic Device Using The Structure App 20170243804 - NAWA; HONAMI ; et al.	2017-08-24
Anisotropic heat conductive composition Grant 9,512,289 - Tanaka , et al. December 6, 2	2016-12-06
Cooling structure Grant 9,322,541 - Hino , et al. April 26, 2	2016-04-26
Heat-dissipating Resin Composition, And Component And Electronic Device Including The Same App 20150327393 - NAWA; Honami ; et al.	2015-11-12
Cooling Structure App 20150180099 - HINO; HIROHISA ; et al.	2015-06-25
Anisotropic Heat Conductive Composition App 20140374648 - TANAKA; Atsushi ; et al.	2014-12-25

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