Naujok; Markus
Patent Applications and Registrations
Patent applications and USPTO patent grants for Naujok; Markus.The latest application filed is for "passivated copper chip pads".
- Naujok; Markus - Dresden N/A DE
- Naujok; Markus - Hsinchu TW
- Naujok; Markus - Hopewell Junction NY
- Naujok; Markus - Hsin-Chu TW
- Naujok, Markus - Hsin-Chu City TW
- Naujok; Markus - Wappingers Falls NY
| Patent | Date |
|---|---|
| Semiconductor devices and structures thereof Grant 9,401,322 - Naujok , et al. July 26, 2 | 2016-07-26 |
| Passivated copper chip pads Grant 9,373,596 - Goebel , et al. June 21, 2 | 2016-06-21 |
| Passivated Copper Chip Pads App 20140295661 - Goebel; Thomas ; et al. | 2014-10-02 |
| Passivated copper chip pads Grant 8,822,324 - Goebel , et al. September 2, 2 | 2014-09-02 |
| Passivated Copper Chip Pads App 20130224946 - Goebel; Thomas ; et al. | 2013-08-29 |
| Methods of manufacturing semiconductor devices Grant 8,148,235 - Naujok , et al. April 3, 2 | 2012-04-03 |
| Semiconductor Devices and Structures Thereof App 20110278730 - Naujok; Markus ; et al. | 2011-11-17 |
| Semiconductor devices and structures thereof Grant 8,013,364 - Naujok , et al. September 6, 2 | 2011-09-06 |
| Methods of Manufacturing Semiconductor Devices App 20100144112 - Naujok; Markus ; et al. | 2010-06-10 |
| Semiconductor Devices and Structures Thereof App 20100032841 - Naujok; Markus ; et al. | 2010-02-11 |
| Methods of manufacturing semiconductor devices and structures thereof Grant 7,629,225 - Naujok , et al. December 8, 2 | 2009-12-08 |
| Passivated Copper Chip Pads App 20090200675 - Goebel; Thomas ; et al. | 2009-08-13 |
| Methods of forming integrated circuit devices having metal interconnect layers therein Grant 7,282,451 - Hong , et al. October 16, 2 | 2007-10-16 |
| Polishing methods and apparatus Grant 7,201,634 - Naujok , et al. April 10, 2 | 2007-04-10 |
| Methods of forming integrated circuit devices having metal interconnect layers therein App 20070045123 - Hong; Duk Ho ; et al. | 2007-03-01 |
| Methods of manufacturing semiconductor devices and structures thereof App 20060281295 - Naujok; Markus ; et al. | 2006-12-14 |
| Dual damascene structure and method Grant 7,091,612 - Kumar , et al. August 15, 2 | 2006-08-15 |
| Composite intermetal dielectric structure including low-k dielectric material Grant 7,041,574 - Kim , et al. May 9, 2 | 2006-05-09 |
| Chemical mechanical polish with multi-zone abrasive-containing matrix App 20060079159 - Naujok; Markus ; et al. | 2006-04-13 |
| Dual damascene structure and method App 20050077628 - Kumar, Kaushik ; et al. | 2005-04-14 |
| Composite intermetal dielectric structure including low-k dielectric material App 20040259273 - Kim, Sun-Oo ; et al. | 2004-12-23 |
| Composite low-k dielectric structure App 20040248400 - Kim, Sun-Oo ; et al. | 2004-12-09 |
| Wafer polishing with counteraction of centrifugal forces on polishing slurry App 20040152402 - Naujok, Markus ; et al. | 2004-08-05 |
| Finishing pad design for multidirectional use Grant 6,761,620 - Naujok July 13, 2 | 2004-07-13 |
| Novel finishing pad design for multidirectional use App 20040053570 - Naujok, Markus | 2004-03-18 |
| Finishing pad design for multidirectional use Grant 6,602,123 - Naujok August 5, 2 | 2003-08-05 |
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