Nauchi; Takashi
Patent Applications and Registrations
Patent applications and USPTO patent grants for Nauchi; Takashi.The latest application filed is for "method for discharging fluid".
- Nauchi; Takashi - Tokyo JP
- Nauchi; Takashi - Saitama JP
| Patent | Date |
|---|---|
| Method for discharging fluid Grant 11,259,415 - Nakamura , et al. February 22, 2 | 2022-02-22 |
| Method For Discharging Fluid App 20210144863 - NAKAMURA; Hideki ; et al. | 2021-05-13 |
| Fluid discharge device Grant 10,932,372 - Nakamura , et al. February 23, 2 | 2021-02-23 |
| Fluid discharge device, fluid discharge method, and fluid application device Grant 10,632,492 - Nauchi , et al. | 2020-04-28 |
| Fluid Discharge Device And Method For Discharging Fluid App 20180376600 - NAKAMURA; Hideki ; et al. | 2018-12-27 |
| Fluid Discharge Device, Fluid Discharge Method, And Fluid Application Device App 20180021803 - NAUCHI; Takashi ; et al. | 2018-01-25 |
| Solder bump forming method and apparatus Grant 9,511,438 - Sato , et al. December 6, 2 | 2016-12-06 |
| Method for manufacturing solder column, apparatus for manufacturing solder column, and solder column Grant 9,283,686 - Nomoto , et al. March 15, 2 | 2016-03-15 |
| Solder Bump Forming Method And Apparatus App 20150007958 - Sato; Issaku ; et al. | 2015-01-08 |
| Method For Manufacturing Solder Column, Apparatus For Manufacturing Solder Column, And Solder Column App 20120305297 - Nomoto; Shinichi ; et al. | 2012-12-06 |
| Apparatus for aligning and dispensing solder columns in an array Grant 6,955,285 - Nomoto , et al. October 18, 2 | 2005-10-18 |
| Apparatus and method for aligning and attaching solder columns to a substrate App 20040144834 - Nomoto, Shinichi ; et al. | 2004-07-29 |
| Apparatus for aligning and dispensing solder columns in an array App 20040124225 - Nomoto, Shinichi ; et al. | 2004-07-01 |
| Solder reflow furnace Grant 5,338,008 - Okuno , et al. August 16, 1 | 1994-08-16 |
| Solder reflow furnace Grant 5,154,338 - Okuno , et al. October 13, 1 | 1992-10-13 |
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