Natzle; Wesley

Patent Applications and Registrations

Patent applications and USPTO patent grants for Natzle; Wesley.The latest application filed is for "dynamic metrology sampling with wafer uniformity control".

Company Profile

0.17.16

Natzle; Wesley - New Paltz NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Selective deposition of germanium spacers on nitride Grant 7,705,385 - Chakravarti , et al. April 27, 2	2010-04-27
Dynamic metrology sampling with wafer uniformity control Grant 7,567,700 - Funk , et al. July 28, 2	2009-07-28
Dynamic metrology sampling for a dual damascene process Grant 7,502,709 - Funk , et al. March 10, 2	2009-03-10
Structure and method to fabricate finfet devices Grant 7,470,629 - Natzle , et al. December 30, 2	2008-12-30
Process control using physical modules and virtual modules Grant 7,451,011 - Funk , et al. November 11, 2	2008-11-11
Method of etching dual pre-doped polysilicon gate stacks using carbon-containing gaseous additions Grant 7,344,965 - Zhang , et al. March 18, 2	2008-03-18
Formula-based run-to-run control Grant 7,292,906 - Funk , et al. November 6, 2	2007-11-06
Dynamic metrology sampling with wafer uniformity control App 20070238201 - Funk; Merritt ; et al.	2007-10-11
Dynamic metrology sampling with wafer uniformity control App 20070237383 - Funk; Merritt ; et al.	2007-10-11
Dynamic metrology sampling for a dual damascene process App 20070231930 - Funk; Merritt ; et al.	2007-10-04
Wafer-to-wafer control using virtual modules Grant 7,212,878 - Funk , et al. May 1, 2	2007-05-01
Low resistance T-gate MOSFET device using a damascene gate process and an innovative oxide removal etch Grant 7,176,534 - Hanafi , et al. February 13, 2	2007-02-13
Method of etching dual pre-doped polysilicon gate stacks using carbon-containing gases additions App 20060183308 - Zhang; Ying ; et al.	2006-08-17
Structure and method to fabricate FinFET devices Grant 7,049,662 - Natzle , et al. May 23, 2	2006-05-23
Wafer-to-wafer control using virtual modules App 20060047356 - Funk; Merritt ; et al.	2006-03-02
Structure and method to fabricate finfet devices App 20060043502 - Natzle; Wesley ; et al.	2006-03-02
Process control using physical modules and virtual modules App 20060042543 - Funk; Merritt ; et al.	2006-03-02
Formula-based run-to-run control App 20060015206 - Funk; Merritt ; et al.	2006-01-19
Method and system for performing a chemical oxide removal process App 20050218114 - Yue, Hongyu ; et al.	2005-10-06
Etching of hard masks Grant 6,926,843 - Cantell , et al. August 9, 2	2005-08-09
Low resistance T-gate MOSFET device using a damascene gate process and an innovative oxide removal etch App 20050170659 - Hanafi, Hussein I. ; et al.	2005-08-04
Structure and method to fabricate finfet devices App 20050110087 - Natzle, Wesley ; et al.	2005-05-26
Removal of post-rie polymer on A1/CU metal line Grant 6,849,153 - Ramachandran , et al. February 1, 2	2005-02-01
Fully-depleted SOI MOSFETs with low source and drain resistance and minimal overlap capacitance using a recessed channel damascene gate process Grant 6,841,831 - Hanafi , et al. January 11, 2	2005-01-11
Method of forming a fully-depleted SOI ( silicon-on-insulator) MOSFET having a thinned channel region Grant 6,660,598 - Hanafi , et al. December 9, 2	2003-12-09
Low resistance T-gate MOSFET device using a damascene gate process and an innovative oxide removal etch Grant 6,656,824 - Hanafi , et al. December 2, 2	2003-12-02
Fully-depleted SOI MOSFETs with low source and drain resistance and minimal overlap capacitance using a recessed channel damascene gate process App 20030211681 - Hanafi, Hussein I. ; et al.	2003-11-13
Method Of Forming A Fully-depleted Soi (silicon-on-insulator) Mosfet Having A Thinned Channel Region App 20030162358 - Hanafi, Hussein I. ; et al.	2003-08-28
Etching of hard masks App 20020063110 - Cantell, Marc W. ; et al.	2002-05-30
Directional CVD process with optimized etchback Grant 6,335,261 - Natzle , et al. January 1, 2	2002-01-01
Method for preparing the surface of a dielectric App 20010016226 - Natzle, Wesley ; et al.	2001-08-23
Removal Of Post-rie Polymer On A1/cu Metal Line App 20010006166 - RAMACHANDRAN, RAVIKUMAR ; et al.	2001-07-05
Removal of post-RIE polymer on Al/Cu metal line Grant 5,980,770 - Ramachandran , et al. November 9, 1	1999-11-09

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