loadpatents
name:-0.030648946762085
name:-0.013016939163208
name:-0.013134002685547
Narisawa; Yoshihiko Patent Filings

Narisawa; Yoshihiko

Patent Applications and Registrations

Patent applications and USPTO patent grants for Narisawa; Yoshihiko.The latest application filed is for "printed circuit board and method for manufacturing same".

Company Profile
3.7.7
  • Narisawa; Yoshihiko - Tokyo JP
  • Narisawa; Yoshihiko - Ushiku JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Printed circuit board and method for manufacturing same
Grant 11,219,123 - Matsuda , et al. January 4, 2
2022-01-04
Probe device, electrical inspection apparatus, and electrical inspection method
Grant 11,137,437 - Takano , et al. October 5, 2
2021-10-05
Printed Circuit Board And Method For Manufacturing Same
App 20210282263 - MATSUDA; Fumihiko ;   et al.
2021-09-09
Printed wiring board for high frequency transmission
Grant 10,736,208 - Takano , et al.
2020-08-04
Probe Device, Electrical Inspection Apparatus, And Electrical Inspection Method
App 20200166564 - TAKANO; Shoji ;   et al.
2020-05-28
Printed Wiring Board For High Frequency Transmission
App 20200015351 - TAKANO; Shoji ;   et al.
2020-01-09
Photomask, photomask set, exposure apparatus and exposure method
Grant 9,274,415 - Takano , et al. March 1, 2
2016-03-01
Photomask, photomask set, exposure apparatus and exposure method
Grant 9,170,483 - Takano , et al. October 27, 2
2015-10-27
Laser processing method and production method of multilayer flexible printed wiring board using laser processing method
Grant 9,148,963 - Matsuda , et al. September 29, 2
2015-09-29
Photomask, Photomask Set, Exposure Apparatus And Exposure Method
App 20150062550 - TAKANO; Shoji ;   et al.
2015-03-05
Photomask, Photomask Set, Exposure Apparatus And Exposure Method
App 20140072904 - TAKANO; Shoji ;   et al.
2014-03-13
Laser Processing Method And Production Method Of Multilayer Flexible Printed Wiring Board Using Laser Processing Method
App 20130089658 - Matsuda; Fumihiko ;   et al.
2013-04-11

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