loadpatents
name:-0.22342801094055
name:-0.022731065750122
name:-0.0036020278930664
NARENDRNATH; Kadthala R. Patent Filings

NARENDRNATH; Kadthala R.

Patent Applications and Registrations

Patent applications and USPTO patent grants for NARENDRNATH; Kadthala R..The latest application filed is for "3d printed chamber components configured for lower film stress and lower operating temperature".

Company Profile
2.23.20
  • NARENDRNATH; Kadthala R. - San Jose CA
  • Narendrnath; Kadthala R. - San Francisco CA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
3d Printed Chamber Components Configured For Lower Film Stress And Lower Operating Temperature
App 20200365374 - NARENDRNATH; Kadthala R. ;   et al.
2020-11-19
3D printed chamber components configured for lower film stress and lower operating temperature
Grant 10,777,391 - Narendrnath , et al. Sept
2020-09-15
Laminated top plate of a workpiece carrier in micromechanical and semiconductor processing
Grant 10,636,690 - Narendrnath
2020-04-28
Edge ring for a substrate processing chamber
Grant 10,553,473 - Raj , et al. Fe
2020-02-04
Retaining ring for lower wafer defects
Grant 10,399,202 - Hu , et al. Sep
2019-09-03
Thermal radiation barrier for substrate processing chamber components
Grant 10,177,014 - Raj , et al. J
2019-01-08
Corrosion resistant abatement system
Grant 10,005,025 - Raj , et al. June 26, 2
2018-06-26
Laminated Top Plate Of A Workpiece Carrier In Micromechanical And Semiconductor Processing
App 20180025932 - Narendrnath; Kadthala R.
2018-01-25
Methods of selective layer deposition
Grant 9,716,012 - Thompson , et al. July 25, 2
2017-07-25
Pad design for electrostatic chuck surface
Grant 9,613,846 - Raj , et al. April 4, 2
2017-04-04
Retaining Ring For Lower Wafer Defects
App 20160271750 - HU; Yongqi ;   et al.
2016-09-22
3d Printed Chamber Components Configured For Lower Film Stress And Lower Operating Temperature
App 20160233060 - NARENDRNATH; Kadthala R. ;   et al.
2016-08-11
Edge Ring For A Substrate Processing Chamber
App 20160181142 - RAJ; Govinda ;   et al.
2016-06-23
Corrosion Resistant Abatement System
App 20160107117 - RAJ; Govinda ;   et al.
2016-04-21
Cyclic Spike Anneal Chemical Exposure For Low Thermal Budget Processing
App 20150275364 - Thompson; David ;   et al.
2015-10-01
Methods Of Selective Layer Deposition
App 20150162214 - Thompson; David ;   et al.
2015-06-11
Pad Design For Electrostatic Chuck Surface
App 20150146339 - RAJ; Govinda ;   et al.
2015-05-28
Thermal Radiation Barrier For Substrate Processing Chamber Components
App 20140165915 - RAJ; Govinda ;   et al.
2014-06-19
Measuring flow properties of multiple gas nozzles of a gas distributor
Grant 8,464,594 - Narendrnath , et al. June 18, 2
2013-06-18
Method to substantially enhance shelf life of hygroscopic components and to improve nano-manufacturing process tool availablity
Grant 8,225,927 - Narendrnath , et al. July 24, 2
2012-07-24
Measuring Flow Properties Of Multiple Gas Nozzles Of A Gas Distributor
App 20110217208 - NARENDRNATH; Kadthala R. ;   et al.
2011-09-08
Component With Enhanced Shelf Life
App 20110114519 - NARENDRNATH; KADTHALA R. ;   et al.
2011-05-19
Substrate support having barrier capable of detecting fluid leakage
Grant 6,913,670 - Narendrnath , et al. July 5, 2
2005-07-05
Electrostatic chuck having dielectric member with stacked layers and manufacture
App 20040190215 - Weldon, Edwin C. ;   et al.
2004-09-30
Electrostatic chuck having composite dielectric layer and method of manufacture
Grant 6,721,162 - Weldon , et al. April 13, 2
2004-04-13
Substrate support having barrier capable of detecting fluid leakage
App 20030188830 - Narendrnath, Kadthala R. ;   et al.
2003-10-09
Fabricating an electrostatic chuck having plasma resistant gas conduits
Grant 6,581,275 - Narendrnath , et al. June 24, 2
2003-06-24
Electrostatic chuck having heater and method
Grant 6,538,872 - Wang , et al. March 25, 2
2003-03-25
Electrostatic chuck bonded to base with a bond layer and method
Grant 6,490,146 - Wang , et al. December 3, 2
2002-12-03
Support for supporting a substrate in a process chamber
Grant 6,490,144 - Narendrnath , et al. December 3, 2
2002-12-03
Electrostatic chuck having improved electrical connector and method
Grant 6,462,928 - Shamouilian , et al. October 8, 2
2002-10-08
Electrostatic chuck having composite dielectric layer and method of manufacture
App 20020135969 - Weldon, Edwin C. ;   et al.
2002-09-26
Process chamber having improved temperature control
Grant 6,440,221 - Shamouilian , et al. August 27, 2
2002-08-27
Fabricating an electrostatic chuck having plasma resistant gas conduits
App 20020095782 - Narendrnath, Kadthala R. ;   et al.
2002-07-25
Electrostatic chuck bonded to base with a bond layer and method
App 20020075624 - Wang, You ;   et al.
2002-06-20
Electrostatic Chuck Having Composite Base And Method
App 20020036881 - SHAMOUILIAN, SHAMOUIL ;   et al.
2002-03-28
Process Chamber Having Improved Temperature Control
App 20010042594 - SHAMOUILIAN, SHAMOUIL ;   et al.
2001-11-22
Electrostatic chuck having gas cavity and method
Grant 6,310,755 - Kholodenko , et al. October 30, 2
2001-10-30
Compliant bond structure for joining ceramic to metal
Grant 6,280,584 - Kumar , et al. August 28, 2
2001-08-28
Thermally conductive conformal media
Grant 6,220,607 - Schneider , et al. April 24, 2
2001-04-24
Electrostatic chuck having improved gas conduits
Grant 6,108,189 - Weldon , et al. August 22, 2
2000-08-22

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