Patent | Date |
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3d Printed Chamber Components Configured For Lower Film Stress And Lower Operating Temperature App 20200365374 - NARENDRNATH; Kadthala R. ;   et al. | 2020-11-19 |
3D printed chamber components configured for lower film stress and lower operating temperature Grant 10,777,391 - Narendrnath , et al. Sept | 2020-09-15 |
Laminated top plate of a workpiece carrier in micromechanical and semiconductor processing Grant 10,636,690 - Narendrnath | 2020-04-28 |
Edge ring for a substrate processing chamber Grant 10,553,473 - Raj , et al. Fe | 2020-02-04 |
Retaining ring for lower wafer defects Grant 10,399,202 - Hu , et al. Sep | 2019-09-03 |
Thermal radiation barrier for substrate processing chamber components Grant 10,177,014 - Raj , et al. J | 2019-01-08 |
Corrosion resistant abatement system Grant 10,005,025 - Raj , et al. June 26, 2 | 2018-06-26 |
Laminated Top Plate Of A Workpiece Carrier In Micromechanical And Semiconductor Processing App 20180025932 - Narendrnath; Kadthala R. | 2018-01-25 |
Methods of selective layer deposition Grant 9,716,012 - Thompson , et al. July 25, 2 | 2017-07-25 |
Pad design for electrostatic chuck surface Grant 9,613,846 - Raj , et al. April 4, 2 | 2017-04-04 |
Retaining Ring For Lower Wafer Defects App 20160271750 - HU; Yongqi ;   et al. | 2016-09-22 |
3d Printed Chamber Components Configured For Lower Film Stress And Lower Operating Temperature App 20160233060 - NARENDRNATH; Kadthala R. ;   et al. | 2016-08-11 |
Edge Ring For A Substrate Processing Chamber App 20160181142 - RAJ; Govinda ;   et al. | 2016-06-23 |
Corrosion Resistant Abatement System App 20160107117 - RAJ; Govinda ;   et al. | 2016-04-21 |
Cyclic Spike Anneal Chemical Exposure For Low Thermal Budget Processing App 20150275364 - Thompson; David ;   et al. | 2015-10-01 |
Methods Of Selective Layer Deposition App 20150162214 - Thompson; David ;   et al. | 2015-06-11 |
Pad Design For Electrostatic Chuck Surface App 20150146339 - RAJ; Govinda ;   et al. | 2015-05-28 |
Thermal Radiation Barrier For Substrate Processing Chamber Components App 20140165915 - RAJ; Govinda ;   et al. | 2014-06-19 |
Measuring flow properties of multiple gas nozzles of a gas distributor Grant 8,464,594 - Narendrnath , et al. June 18, 2 | 2013-06-18 |
Method to substantially enhance shelf life of hygroscopic components and to improve nano-manufacturing process tool availablity Grant 8,225,927 - Narendrnath , et al. July 24, 2 | 2012-07-24 |
Measuring Flow Properties Of Multiple Gas Nozzles Of A Gas Distributor App 20110217208 - NARENDRNATH; Kadthala R. ;   et al. | 2011-09-08 |
Component With Enhanced Shelf Life App 20110114519 - NARENDRNATH; KADTHALA R. ;   et al. | 2011-05-19 |
Substrate support having barrier capable of detecting fluid leakage Grant 6,913,670 - Narendrnath , et al. July 5, 2 | 2005-07-05 |
Electrostatic chuck having dielectric member with stacked layers and manufacture App 20040190215 - Weldon, Edwin C. ;   et al. | 2004-09-30 |
Electrostatic chuck having composite dielectric layer and method of manufacture Grant 6,721,162 - Weldon , et al. April 13, 2 | 2004-04-13 |
Substrate support having barrier capable of detecting fluid leakage App 20030188830 - Narendrnath, Kadthala R. ;   et al. | 2003-10-09 |
Fabricating an electrostatic chuck having plasma resistant gas conduits Grant 6,581,275 - Narendrnath , et al. June 24, 2 | 2003-06-24 |
Electrostatic chuck having heater and method Grant 6,538,872 - Wang , et al. March 25, 2 | 2003-03-25 |
Electrostatic chuck bonded to base with a bond layer and method Grant 6,490,146 - Wang , et al. December 3, 2 | 2002-12-03 |
Support for supporting a substrate in a process chamber Grant 6,490,144 - Narendrnath , et al. December 3, 2 | 2002-12-03 |
Electrostatic chuck having improved electrical connector and method Grant 6,462,928 - Shamouilian , et al. October 8, 2 | 2002-10-08 |
Electrostatic chuck having composite dielectric layer and method of manufacture App 20020135969 - Weldon, Edwin C. ;   et al. | 2002-09-26 |
Process chamber having improved temperature control Grant 6,440,221 - Shamouilian , et al. August 27, 2 | 2002-08-27 |
Fabricating an electrostatic chuck having plasma resistant gas conduits App 20020095782 - Narendrnath, Kadthala R. ;   et al. | 2002-07-25 |
Electrostatic chuck bonded to base with a bond layer and method App 20020075624 - Wang, You ;   et al. | 2002-06-20 |
Electrostatic Chuck Having Composite Base And Method App 20020036881 - SHAMOUILIAN, SHAMOUIL ;   et al. | 2002-03-28 |
Process Chamber Having Improved Temperature Control App 20010042594 - SHAMOUILIAN, SHAMOUIL ;   et al. | 2001-11-22 |
Electrostatic chuck having gas cavity and method Grant 6,310,755 - Kholodenko , et al. October 30, 2 | 2001-10-30 |
Compliant bond structure for joining ceramic to metal Grant 6,280,584 - Kumar , et al. August 28, 2 | 2001-08-28 |
Thermally conductive conformal media Grant 6,220,607 - Schneider , et al. April 24, 2 | 2001-04-24 |
Electrostatic chuck having improved gas conduits Grant 6,108,189 - Weldon , et al. August 22, 2 | 2000-08-22 |