NARAYANASAMY; Jayaganasan

Patent Applications and Registrations

Patent applications and USPTO patent grants for NARAYANASAMY; Jayaganasan.The latest application filed is for "method for connecting an electrical device to a bottom unit by using a solderless joint".

Company Profile

8.5.9

NARAYANASAMY; Jayaganasan - Melaka MY
Narayanasamy; Jayaganasan - Melaka - Durian Tunggal MY
Narayanasamy; Jayaganasan - Durian Tunggal MY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method For Connecting An Electrical Device To A Bottom Unit By Using A Solderless Joint App 20220278085 - CHIANG; Chau Fatt ; et al.	2022-09-01
Package lead design with grooves for improved dambar separation Grant 11,362,023 - Narayanasamy , et al. June 14, 2	2022-06-14
Power Semiconductor Package And Method For Fabricating A Power Semiconductor Package App 20220115245 - Narayanasamy; Jayaganasan ; et al.	2022-04-14
Semiconductor Package Having A Chip Carrier With A Pad Offset Feature App 20220102263 - Ng; Chee Yang ; et al.	2022-03-31
Pressure sensor having a lidless/laminate structure Grant 11,274,984 - Chiang , et al. March 15, 2	2022-03-15
Pressure Sensor App 20210025774 - Chiang; Chau Fatt ; et al.	2021-01-28
Package Lead Design with Grooves for Improved Dambar Separation App 20210013135 - Narayanasamy; Jayaganasan ; et al.	2021-01-14
Selective plating of semiconductor package leads Grant 10,651,109 - Abd Hamid , et al.	2020-05-12
Selective Plating of Semiconductor Package Leads App 20200020607 - Abd Hamid; Syahir ; et al.	2020-01-16
Selective Plating of Semiconductor Package Leads App 20200020621 - Abd Hamid; Syahir ; et al.	2020-01-16
Method for forming a matrix composite layer and workpiece with a matrix composite layer Grant 10,457,001 - Narayanasamy , et al. Oc	2019-10-29
Semiconductor component and method for producing a semiconductor component Grant 10,121,723 - Lau , et al. November 6, 2	2018-11-06
Method for Forming a Matrix Composite Layer and Workpiece With a Matrix Composite Layer App 20180297301 - Narayanasamy; Jayaganasan ; et al.	2018-10-18
Semiconductor Component And Method For Producing A Semiconductor Component App 20180301390 - Lau; Kok Tee ; et al.	2018-10-18

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