loadpatents
name:-0.049865007400513
name:-0.049271106719971
name:-0.019466161727905
NAPRA CO., LTD. Patent Filings

NAPRA CO., LTD.

Patent Applications and Registrations

Patent applications and USPTO patent grants for NAPRA CO., LTD..The latest application filed is for "metal particle".

Company Profile
12.63.60
  • NAPRA CO., LTD. - Tokyo N/A JP
  • NAPRA CO., LTD. - TOKTYO JP
  • NAPRA CO., LTD. - Katsushika-Ku, Tokyo N/A JP
  • NAPRA CO., LTD - Tokyo JP
  • Napra Co., Ltd. - Katsushika-ku N/A JP
  • NAPRA CO., LTD. - 204, 8-15-17 Okudo, Katsushita-ku, Tokyo JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Bonding structure
Grant 11,453,089 - Sekine September 27, 2
2022-09-27
Metal Particle
App 20220219265 - SEKINE; Shigenobu
2022-07-14
Metal particle
Grant 11,364,575 - Sekine June 21, 2
2022-06-21
Metal Particle
App 20210283725 - SEKINE; Shigenobu
2021-09-16
Bonding Structure
App 20210078112 - SEKINE; Shigenobu
2021-03-18
Metal Particle
App 20210078111 - SEKINE; Shigenobu
2021-03-18
Joint structure
Grant 10,906,136 - Sekine February 2, 2
2021-02-02
Preform for semiconductor encapsulation
Grant 10,629,506 - Sekine , et al.
2020-04-21
Metal particle and articles formed therefrom
Grant 10,507,551 - Sekine Dec
2019-12-17
Metal particle and electroconductive paste formed therefrom
Grant 10,478,924 - Sekine Nov
2019-11-19
Semiconductor device and method for manufacturing the same
Grant 10,468,376 - Sekine No
2019-11-05
Metal Particle And Electroconductive Paste Formed Therefrom
App 20180311771 - SEKINE; Shigenobu
2018-11-01
Metal Particle And Articles Formed Therefrom
App 20180290243 - SEKINE; Shigenobu
2018-10-11
Semiconductor Device And Method For Manufacturing The Same
App 20180269179 - Sekine; Shigenobu
2018-09-20
Preform For Semiconductor Encapsulation
App 20180218954 - SEKINE; Shigenobu ;   et al.
2018-08-02
Metal particles having intermetallic compound nano-composite structure crystal
Grant 10,016,848 - Sekine July 10, 2
2018-07-10
Multi-layer preform sheet
Grant 9,950,496 - Sekine , et al. April 24, 2
2018-04-24
Method for forming functional part in minute space
Grant 9,950,925 - Sekine , et al. April 24, 2
2018-04-24
Three-dimensional laminated circuit board, electronic device, information processing system, and information network system
Grant 9,924,592 - Sekine , et al. March 20, 2
2018-03-20
Three-Dimensional Laminated Circuit Board, Electronic Device, Information Processing System, And Information Network System
App 20180054887 - SEKINE; Shigenobu ;   et al.
2018-02-22
Multi-layer Preform Sheet
App 20180009194 - SEKINE; Shigenobu ;   et al.
2018-01-11
Method For Forming Functional Part In Minute Space
App 20170305743 - Sekine; Shigenobu ;   et al.
2017-10-26
Metal Particle, Paste, Formed Article, And Laminated Article
App 20170282302 - SEKINE; Shigenobu
2017-10-05
Semiconductor Device
App 20170236762 - SEKINE; Shigenobu
2017-08-17
Semiconductor device
Grant 9,735,074 - Sekine August 15, 2
2017-08-15
Substrate with built-in passive element
Grant 9,730,325 - Sekine , et al. August 8, 2
2017-08-08
Substrate for electronic device and electronic device
Grant 9,704,793 - Sekine , et al. July 11, 2
2017-07-11
Insulating paste, electronic device and method for forming insulator
Grant 9,691,519 - Sekine , et al. June 27, 2
2017-06-27
Electronic device and manufacturing method therefor
Grant 9,685,394 - Sekine , et al. June 20, 2
2017-06-20
Circuit Board And Electronic Device
App 20170117353 - SEKINE; Shigenobu ;   et al.
2017-04-27
Electronic device, method of manufacturing the same, metal particle, and electroconductive paste
Grant 9,515,044 - Sekine December 6, 2
2016-12-06
Semiconductor substrate, eletronic device and method for manufacturing the same
Grant 9,460,965 - Sekine , et al. October 4, 2
2016-10-04
Integrated circuit device
Grant 9,349,720 - Sekine , et al. May 24, 2
2016-05-24
Method for producing spherical particles, having nanometer size, crystalline structure, comprising providing a swirling plasma gas flow
Grant 9,339,871 - Sekine , et al. May 17, 2
2016-05-17
Functional material
Grant 9,293,416 - Sekine , et al. March 22, 2
2016-03-22
Semiconductor substrate, electronic device and method for manufacturing the same
Grant 9,230,860 - Sekine , et al. January 5, 2
2016-01-05
Semiconductor Substrate, Eletronic Device And Method For Manufacturing The Same
App 20150357273 - Sekine; Shigenobu ;   et al.
2015-12-10
Junction and electrical connection
Grant 9,142,518 - Sekine September 22, 2
2015-09-22
Method For Forming Conductor In Minute Space
App 20150228382 - Sekine; Shigenobu ;   et al.
2015-08-13
Wiring substrate and manufacturing method therefor
Grant 9,076,786 - Sekine , et al. July 7, 2
2015-07-07
Junction And Electrical Connection
App 20150097300 - Sekine; Shigenobu
2015-04-09
Functional Material
App 20150054158 - Sekine; Shigenobu ;   et al.
2015-02-26
Wiring Substrate And Manufacturing Method Therefor
App 20150041990 - Sekine; Shigenobu ;   et al.
2015-02-12
Integrated Circuit Device
App 20150035114 - Sekine; Shigenobu ;   et al.
2015-02-05
Spherical Particles Having Nanometer Size, Crystalline Structure, And Good Sphericity And Method For Producing The Same
App 20140290435 - Sekine; Shigenobu ;   et al.
2014-10-02
Substrate With Built-in Passive Element
App 20140204548 - Sekine; Shigenobu ;   et al.
2014-07-24
Light-emitting device comprising vertical conductors and through electrodes and method for manufacturing the same
Grant 8,766,312 - Sekine , et al. July 1, 2
2014-07-01
Spherical particles having nanometer size, crystalline structure, and good sphericity and method for producing the same
Grant 8,758,900 - Sekine , et al. June 24, 2
2014-06-24
Electronic device, conductive composition, metal filling apparatus, and electronic device manufacturing method
Grant 8,759,211 - Sekine , et al. June 24, 2
2014-06-24
Insulating Paste, Electronic Device And Method For Forming Insulator
App 20140147578 - Sekine; Shigenobu ;   et al.
2014-05-29
Method For Producing Wiring Board Having Through Hole Or Non-through Hole
App 20140023777 - Sekine; Shigenobu ;   et al.
2014-01-23
Circuit board, electronic device and method for manufacturing the same
Grant 8,609,999 - Sekine , et al. December 17, 2
2013-12-17
Substrate for electronic device, stack for electronic device, electronice device, and method for manufacturing the same
Grant 8,580,581 - Sekine , et al. November 12, 2
2013-11-12
Wiring board having through hole or non-through hole, and method for producing the same
Grant 8,569,632 - Sekine , et al. October 29, 2
2013-10-29
Electronic Device
App 20130277850 - Sekine; Shigenobu ;   et al.
2013-10-24
Conductive Fine Powder, Conductive Paste And Electronic Component
App 20130250481 - Sekine; Shigenobu ;   et al.
2013-09-26
Method For Forming Functional Part In Minute Space
App 20130136645 - Sekine; Shigenobu ;   et al.
2013-05-30
Electronic device, conductive composition, metal filling apparatus, and electronic device manufacturing method
Grant 8,415,784 - Sekine , et al. April 9, 2
2013-04-09
Semiconductor Substrate, Eletronic Device And Method For Manufacturing The Same
App 20130075930 - Sekine; Shigenobu ;   et al.
2013-03-28
Filling material and filling method using the same
Grant 8,377,565 - Sekine , et al. February 19, 2
2013-02-19
Circuit board, electronic device and method for manufacturing the same
Grant 8,217,280 - Sekine , et al. July 10, 2
2012-07-10
Electronic device
Grant 8,217,403 - Sekine , et al. July 10, 2
2012-07-10
Substrate For Electronic Device And Electronic Device
App 20120168206 - Sekine; Shigenobu ;   et al.
2012-07-05
Light-emitting Device And Method For Manufacturing The Same
App 20120091481 - Sekine; Shigenobu ;   et al.
2012-04-19
Method for filling metal into fine space
Grant 8,079,131 - Sekine , et al. December 20, 2
2011-12-20
Electronic Device And Manufacturing Method Therefor
App 20110284912 - Sekine; Shigenobu ;   et al.
2011-11-24
Filling Material And Filling Method Using The Same
App 20110262762 - Sekine; Shigenobu ;   et al.
2011-10-27
Solar Cell
App 20110232740 - SEKINE; Shigenobu ;   et al.
2011-09-29
Circuit Board, Electronic Device And Method For Manuacturing The Same
App 20110141704 - SEKINE; Shigenobu ;   et al.
2011-06-16
Substrate For Electronic Device, Stack For Electronic Device, Electronic Device, And Method For Manufacturing The Same
App 20110140281 - SEKINE; Shigenobu ;   et al.
2011-06-16
Circuit Board, Electronic Device And Method For Manufacturing The Same
App 20110120759 - SEKINE; Shigenobu ;   et al.
2011-05-26
Circuit board, electronic device and method for manufacturing the same
Grant 7,910,837 - Sekine , et al. March 22, 2
2011-03-22
Electronic Device, Conductive Composition, Metal Filling Apparatus, And Electronic Device Manufacturing Method
App 20100301485 - SEKINE; Shigenobu ;   et al.
2010-12-02
Light-emitting diode, light-emitting device, lighting apparatus, display, and signal light
Grant 7,842,958 - Sekine , et al. November 30, 2
2010-11-30
Method for producing spherical particles having nanometer size, crystalline structure, and good sphericity
Grant 7,803,210 - Sekine , et al. September 28, 2
2010-09-28
Spherical particles having nanometer size, crystalline structure, and good sphericity and method for producing the same
App 20100239863 - Sekine; Shigenobu ;   et al.
2010-09-23
Lubricant composition and bearing structure
Grant 7,781,382 - Sekine , et al. August 24, 2
2010-08-24
Metal powder with nano-composite structure and its production method using a self-assembling technique
Grant 7,736,585 - Sekine June 15, 2
2010-06-15
Method For Filling Metal Into Fine Space
App 20100126688 - SEKINE; Shigenobu ;   et al.
2010-05-27
Method For Filling Through Hole Or Non-through Hole Formed On Board With Filler
App 20100031501 - Sekine; Shigenobu ;   et al.
2010-02-11
Metal powder with nano-composite structure and its production method using a self-assembling technique
App 20090304834 - Sekine; Shigenobu
2009-12-10
Metal powder with nano-composite structure and its production method using a self assembling technique
Grant 7,547,346 - Sekine June 16, 2
2009-06-16
Circuit Board, Electronic Device And Method For Manufacturing The Same
App 20090084588 - SEKINE; Shigenobu ;   et al.
2009-04-02
Lubricant composition and bearing structure
App 20080132433 - Sekine; Shigenobu ;   et al.
2008-06-05
Wiring board having through hole or non-through hole, and method for producing the same
App 20080095926 - Sekine; Shigenobu ;   et al.
2008-04-24
Spherical Particles Having Nanometer Size, Crystalline Structure, And Good Sphericity And Method For Producing
App 20080038555 - SEKINE; Shigenobu ;   et al.
2008-02-14
Metal powder with nano-composite structure and its production method using a self assembling technique
App 20060144188 - Sekine; Shigenobu
2006-07-06

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.

© 2024 USPTO.report | Privacy Policy | Resources | RSS Feed of Trademarks | Trademark Filings Twitter Feed