| Patent | Date |
|---|
Method of forming an aluminum oxide layer, metal surface with aluminum oxide layer, and electronic device
Grant 11,424,201 - Rogalli , et al. August 23, 2 | 2022-08-23 |
Semiconductor substrate having a bond pad material based on aluminum
Grant 11,410,950 - Pfahl , et al. August 9, 2 | 2022-08-09 |
Component and Method of Manufacturing a Component Using an Ultrathin Carrier
App 20220246475 - Mayer; Karl ; et al. | 2022-08-04 |
Semiconductor Device Including A Solder Compound Containing A Compound Sn/sb
App 20220216173 - Behrens; Thomas ; et al. | 2022-07-07 |
Component and method of manufacturing a component using an ultrathin carrier
Grant 11,367,654 - Mayer , et al. June 21, 2 | 2022-06-21 |
Semiconductor Device Including Bonding Pad Metal Layer Structure
App 20220059477 - Napetschnig; Evelyn ; et al. | 2022-02-24 |
Chip Package And Method Of Forming A Chip Package
App 20210375792 - SAX; Harry Walter ; et al. | 2021-12-02 |
Semiconductor device including a solder compound containing a compound Sn/Sb
Grant 11,069,644 - Behrens , et al. July 20, 2 | 2021-07-20 |
Chip Arrangements
App 20210167034 - MENGEL; Manfred ; et al. | 2021-06-03 |
Semiconductor Substrate Having a Bond Pad Material Based on Aluminum
App 20210091025 - Pfahl; Gert ; et al. | 2021-03-25 |
Chip arrangements
Grant 10,930,614 - Mengel , et al. February 23, 2 | 2021-02-23 |
Porous Cu on Cu surface for semiconductor packages
Grant 10,914,018 - Pielmeier , et al. February 9, 2 | 2021-02-09 |
Electronic Device, Electronic Module And Methods For Fabricating The Same
App 20200343094 - Frank; Paul ; et al. | 2020-10-29 |
Porous Cu on Cu Surface for Semiconductor Packages
App 20200291538 - Pielmeier; Norbert ; et al. | 2020-09-17 |
Electronic device, electronic module and methods for fabricating the same
Grant 10,741,402 - Frank , et al. A | 2020-08-11 |
Semiconductor Device Including A Solder Compound Containing A Compound Sn/sb
App 20200105704 - Behrens; Thomas ; et al. | 2020-04-02 |
Solder metallization stack and methods of formation thereof
Grant 10,573,611 - Karlovsky , et al. Feb | 2020-02-25 |
Adhesion Enhancing Structures for a Package
App 20200043876 - Napetschnig; Evelyn ; et al. | 2020-02-06 |
Component and Method of Manufacturing a Component Using an Ultrathin Carrier
App 20190148233 - Mayer; Karl ; et al. | 2019-05-16 |
Method for processing a semiconductor region and an electronic device
Grant 10,276,362 - Napetschnig , et al. | 2019-04-30 |
Semiconductor devices and methods of forming thereof
Grant 10,262,959 - Napetschnig , et al. | 2019-04-16 |
Solder Metallization Stack and Methods of Formation Thereof
App 20190051624 - Karlovsky; Kamil ; et al. | 2019-02-14 |
Component and method of manufacturing a component using an ultrathin carrier
Grant 10,186,458 - Mayer , et al. Ja | 2019-01-22 |
Method of Forming an Aluminum Oxide Layer, Metal Surface with Aluminum Oxide Layer, and Electronic Device
App 20180366427 - Rogalli; Michael ; et al. | 2018-12-20 |
Solder metallization stack and methods of formation thereof
Grant 10,115,688 - Karlovsky , et al. October 30, 2 | 2018-10-30 |
Electronic Device, Electronic Module And Methods For Fabricating The Same
App 20180082848 - Frank; Paul ; et al. | 2018-03-22 |
Chip Arrangements
App 20170323865 - MENGEL; Manfred ; et al. | 2017-11-09 |
Method For Processing A Semiconductor Region And An Electronic Device
App 20170316934 - NAPETSCHNIG; Evelyn ; et al. | 2017-11-02 |
Solder alloys and arrangements
Grant 9,735,126 - Mengel , et al. August 15, 2 | 2017-08-15 |
Method for processing a semiconductor workpiece and semiconductor workpiece
Grant 9,627,335 - Henneck , et al. April 18, 2 | 2017-04-18 |
Semiconductor Devices and Methods of Forming Thereof
App 20170033066 - Napetschnig; Evelyn ; et al. | 2017-02-02 |
Solder Metallization Stack and Methods of Formation Thereof
App 20160351516 - Karlovsky; Kamil ; et al. | 2016-12-01 |
Semiconductor devices and methods of forming thereof
Grant 9,484,316 - Napetschnig , et al. November 1, 2 | 2016-11-01 |
Method for Processing a Semiconductor Workpiece and Semiconductor Workpiece
App 20150325535 - HENNECK; Stephan ; et al. | 2015-11-12 |
Layer Stacks And Integrated Circuit Arrangements
App 20150228607 - Schmidt; Tobias ; et al. | 2015-08-13 |
Semiconductor Devices and Methods of Forming Thereof
App 20150123264 - Napetschnig; Evelyn ; et al. | 2015-05-07 |
Backside processing of semiconductor devices
Grant 8,866,299 - Harrison , et al. October 21, 2 | 2014-10-21 |
Backside Processing of Semiconductor Devices
App 20140015141 - Harrison; Mark ; et al. | 2014-01-16 |
Component and Method of Manufacturing a Component Using an Ultrathin Carrier
App 20140008805 - Mayer; Karl ; et al. | 2014-01-09 |
Backside processing of semiconductor devices
Grant 8,487,440 - Harrison , et al. July 16, 2 | 2013-07-16 |
Solder Alloys And Arrangements
App 20120313230 - MENGEL; Manfred ; et al. | 2012-12-13 |
Layer Stacks And Integrated Circuit Arrangements
App 20120068345 - Schmidt; Tobias ; et al. | 2012-03-22 |
Backside Processing of Semiconductor Devices
App 20120007244 - Harrison; Mark ; et al. | 2012-01-12 |
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