NANTONG FUJITSU MICROELECTRONICS CO., LTD.
Patent Applications and Registrations
Patent applications and USPTO patent grants for NANTONG FUJITSU MICROELECTRONICS CO., LTD..The latest application filed is for "fabricating method for wafer-level packaging".
Company Profile
2.31.50
- NANTONG FUJITSU MICROELECTRONICS CO., LTD. - Nantong CN
- NANTONG FUJITSU MICROELECTRONICS CO., LTD. - Nantong, Jiangsu CN
- NANTONG FUJITSU MICROELECTRONICS CO., LTD. -
- NANTONG FUJITSU MICROELECTRONICS CO., LTD. - Jiangsu CN
- NANTONG FUJITSU MICROELECTRONICS CO., LTD - Nantong, Jiangsu CN
Patent Activity
| Patent | Date |
|---|---|
| Fabricating Method For Wafer-level Packaging App 20170213810 - DING; Wanchun | 2017-07-27 |
| Structure And Method Of Reinforcing A Conductor Soldering Point Of Semiconductor Device App 20170207189 - SHI; Haizhong ; et al. | 2017-07-20 |
| System-level Packaging Structures App 20170077035 - TAO; Yujuan ; et al. | 2017-03-16 |
| 3D system-level packaging methods and structures Grant 9,595,490 - Tao , et al. March 14, 2 | 2017-03-14 |
| Semiconductor IC packaging methods and structures Grant 9,589,815 - Lin , et al. March 7, 2 | 2017-03-07 |
| Metal contact for semiconductor device Grant 9,548,282 - Lin , et al. January 17, 2 | 2017-01-17 |
| System-level packaging methods and structures Grant 9,543,269 - Tao , et al. January 10, 2 | 2017-01-10 |
| Semiconductor packaging structure and forming method therefor Grant 9,515,010 - Xia , et al. December 6, 2 | 2016-12-06 |
| Flip-chip on leadframe semiconductor packaging structure and fabrication method thereof Grant 9,502,337 - Shi November 22, 2 | 2016-11-22 |
| Packaging structure Grant 9,497,862 - Shi , et al. November 15, 2 | 2016-11-15 |
| Package structure Grant 9,485,868 - Tao November 1, 2 | 2016-11-01 |
| Method and structure for wafer-level packaging Grant 9,437,511 - Shi September 6, 2 | 2016-09-06 |
| Semiconductor packaging structure Grant 9,431,325 - Lin , et al. August 30, 2 | 2016-08-30 |
| Method for forming package structure Grant 9,397,070 - Tao July 19, 2 | 2016-07-19 |
| Method And Structure For Fan-out Wafer Level Packaging App 20160190028 - Shi; Lei | 2016-06-30 |
| Method And Structure For Fan-out Wafer Level Packaging App 20160189983 - Shi; Lei | 2016-06-30 |
| Metal contact for semiconductor device Grant 9,379,077 - Lin , et al. June 28, 2 | 2016-06-28 |
| Method And Structure For Wafer-level Packaging App 20160172263 - SHI; JIANGEN | 2016-06-16 |
| Substrate With A Supporting Plate And Fabrication Method Thereof App 20160172313 - Zhu; Haiqing | 2016-06-16 |
| Method And Structure For Wafer-level Packaging App 20160172321 - GAO; GUOHUA | 2016-06-16 |
| Method for chip package Grant 9,362,173 - Shi , et al. June 7, 2 | 2016-06-07 |
| Semiconductor Packaging Structure And Method App 20160155684 - LIN; CHANG-MING ; et al. | 2016-06-02 |
| Flip-chip On Leadframe Semiconductor Packaging Structure And Fabrication Method Thereof App 20160126166 - SHI; LEI | 2016-05-05 |
| Testing Probe And Semiconductor Testing Fixture, And Fabrication Methods Thereof App 20160124016 - SHI; LEI | 2016-05-05 |
| Testing Probe, Semiconductor Testing Fixture And Fabrication Method Thereof App 20160124018 - SHI; LEI | 2016-05-05 |
| Testing Probe And Semiconductor Testing Fixture, And Fabrication Methods Thereof App 20160124017 - SHI; LEI | 2016-05-05 |
| Semiconductor Testing Fixture And Fabrication Method Thereof App 20160124019 - SHI; LEI | 2016-05-05 |
| Semiconductor Testing Fixture And Fabrication Method Thereof App 20160124020 - SHI; LEI | 2016-05-05 |
| Packaging method Grant 9,324,583 - Shi , et al. April 26, 2 | 2016-04-26 |
| Semiconductor packaging structure and method Grant 9,293,338 - Lin , et al. March 22, 2 | 2016-03-22 |
| Metal contact for chip packaging structure Grant 9,293,432 - Lin , et al. March 22, 2 | 2016-03-22 |
| Fan-out high-density packaging methods and structures Grant 9,287,205 - Shi , et al. March 15, 2 | 2016-03-15 |
| Semiconductor Packaging Structure And Forming Method Therefor App 20160043020 - XIA; Xin ; et al. | 2016-02-11 |
| Method For Forming Package Structure App 20160035696 - Tao; Yujuan | 2016-02-04 |
| Package Structure App 20150382467 - Tao; Yujuan | 2015-12-31 |
| Wafer Packaging Structure And Packaging Method App 20150380369 - DING; Wanchun | 2015-12-31 |
| Semiconductor Device Package And Packaging Method App 20150303159 - LIN; Chang-Ming ; et al. | 2015-10-22 |
| Chip Packaging Structure And Packaging Method App 20150294949 - Lin; Chang-Ming ; et al. | 2015-10-15 |
| Semiconductor Device And Manufacturing Method Thereof App 20150287688 - Lin; Chang-Ming ; et al. | 2015-10-08 |
| Fan-out High-density Packaging Methods And Structures App 20150228568 - SHI; LEI ; et al. | 2015-08-13 |
| Three-dimensional system-level packaging methods and structures Grant 9,099,448 - Tao , et al. August 4, 2 | 2015-08-04 |
| Fan-out high-density packaging methods and structures Grant 9,040,347 - Tao , et al. May 26, 2 | 2015-05-26 |
| Method for chip packaging Grant 8,883,627 - Shi , et al. November 11, 2 | 2014-11-11 |
| Semiconductor Packaging Structure And Method App 20140124914 - LIN; CHANG-MING ; et al. | 2014-05-08 |
| Semiconductor Ic Packaging Methods And Structures App 20140124927 - LIN; CHANG-MING ; et al. | 2014-05-08 |
| Semiconductor Device And Fabrication Method App 20140124929 - LIN; CHANG-MING ; et al. | 2014-05-08 |
| Semiconductor Packaging Structure And Method For Forming The Same App 20140124928 - LIN; CHANG-MING ; et al. | 2014-05-08 |
| 3d System-level Packaging Methods And Structures App 20130320533 - Tao; Yujuan ; et al. | 2013-12-05 |
| Three-dimensional System-level Packaging Methods And Structures App 20130320535 - Tao; Yujuan ; et al. | 2013-12-05 |
| Packaging Structure App 20130301228 - Tao; Yujuan ; et al. | 2013-11-14 |
| Packaging Method App 20130302947 - Tao; Yujuan ; et al. | 2013-11-14 |
| Method For Chip Packaging App 20130280904 - Shi; Lei ; et al. | 2013-10-24 |
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