Nanjo; Masatoshi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Nanjo; Masatoshi.The latest application filed is for "wafer dividing method".

Company Profile

0.8.9

Nanjo; Masatoshi - Tokyo JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Wafer dividing method Grant 7,727,810 - Arai , et al. June 1, 2	2010-06-01
Semiconductor device including semiconductor memory element and method for producing same Grant 7,592,235 - Nanjo September 22, 2	2009-09-22
Semiconductor device including semiconductor memory element and method for producing same Grant 7,459,767 - Nanjo December 2, 2	2008-12-02
Cassette having separation plates for storing a plurality of semiconductor wafers Grant 7,325,692 - Nanjo February 5, 2	2008-02-05
Wafer dividing method App 20070029684 - Arai; Kazuhisa ; et al.	2007-02-08
Method for manufacturing semiconductor chip Grant 7,172,950 - Takezoe , et al. February 6, 2	2007-02-06
Semiconductor device including semiconductor memory element and method for producing same App 20060208329 - Nanjo; Masatoshi	2006-09-21
Semiconductor device including semiconductor memory element and method for producing same App 20050255674 - Nanjo, Masatoshi	2005-11-17
Semiconductor wafer protective device and semiconductor wafer treatment method Grant 6,943,045 - Kitamura , et al. September 13, 2	2005-09-13
Wafer support plate Grant 6,927,416 - Arai , et al. August 9, 2	2005-08-09
Method of processing a semiconductor wafer Grant 6,869,830 - Nanjo March 22, 2	2005-03-22
Cassette for storing a plurality of semiconductor wafers App 20040256284 - Nanjo, Masatoshi	2004-12-23
Semiconductor wafer protective device and semiconductor wafer treatment method App 20040235269 - Kitamura, Masahiko ; et al.	2004-11-25
Method for manufacturing semiconductor chip App 20040192012 - Takezoe, Kouji ; et al.	2004-09-30
Wafer support plate App 20040124413 - Arai, Kazuhisa ; et al.	2004-07-01
Method of processing a semiconductor wafer App 20040092108 - Yajima, Kouichi ; et al.	2004-05-13
Method of processing a semiconductor wafer and substrate for semiconductor wafers used in the same App 20030102557 - Nanjo, Masatoshi	2003-06-05

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.