Nanaumi; Ken

Patent Applications and Registrations

Patent applications and USPTO patent grants for Nanaumi; Ken.The latest application filed is for "positive-type photosensitive resin composition, method for producing resist pattern, semiconductor device, and electronic device".

Company Profile

0.12.6

Nanaumi; Ken - Chikusei JP
Nanaumi; Ken - Ibaraki JP
Nanaumi; Ken - Shimodate JP
Nanaumi; Ken - Shimodate-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Positive-type photosensitive resin composition, method for production of resist pattern, semiconductor device, and electronic device Grant 9,786,576 - Matsutani , et al. October 10, 2	2017-10-10
Positive-type photosensitive resin composition, method for producing resist pattern, semiconductor device, and electronic device Grant 8,461,699 - Matsutani , et al. June 11, 2	2013-06-11
Positive-type photosensitive resin composition, method for producing resist pattern, and electronic component Grant 8,426,985 - Matsutani , et al. April 23, 2	2013-04-23
Epoxy resin molding material for sealing and electronic component device Grant 8,084,130 - Hamada , et al. December 27, 2	2011-12-27
Positive-type Photosensitive Resin Composition, Method For Producing Resist Pattern, Semiconductor Device, And Electronic Device App 20110254178 - Matsutani; Hiroshi ; et al.	2011-10-20
Positive-type Photosensitive Resin Composition, Method For Production Of Resist Pattern, Semiconductor Device, And Electronic Device App 20110250396 - Matsutani; Hiroshi ; et al.	2011-10-13
Postive-type Photosensitive Resin Composition, Method For Producing Resist Pattern, And Electronic Component App 20110204528 - Matsutani; Hiroshi ; et al.	2011-08-25
Epoxy Resin Molding Material For Sealing And Electronic Component Device App 20090326100 - Hamada; Mitsuyoshi ; et al.	2009-12-31
Dihydrobenzoxazine ring-containing resin, phenolic-triazine-aldehyde condensate and epoxy resin Grant 7,538,150 - Oohori , et al. May 26, 2	2009-05-26
Thermosetting resin composition, and prepreg, laminated board for wiring board and printed wiring board using the same App 20060008632 - Oohori; Kenichi ; et al.	2006-01-12
Thermosetting resin composition, and prepreg, laminate for circuit board, and printed circuit board each made therewith App 20040076805 - Oohori, Kenichi ; et al.	2004-04-22
Adhesive film formed of a siloxane-modified polyamideimide resin composition, adhesive sheet and semiconductor device Grant 6,475,629 - Takeuchi , et al. November 5, 2	2002-11-05
Siloxane-modified polyamideimide resin composition, adhesive film, adhesive sheet and semiconductor device Grant 6,252,010 - Takeuchi , et al. June 26, 2	2001-06-26
Method of preparing vegetable oil-modified phenolic resin and laminate produced by using the same Grant 5,380,789 - Nanaumi , et al. January 10, 1	1995-01-10
Process for producing phenolic resins Grant 4,229,330 - Konii , et al. October 21, 1	1980-10-21

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