Namishia; Daniel
Patent Applications and Registrations
Patent applications and USPTO patent grants for Namishia; Daniel.The latest application filed is for "methods for pillar connection on frontside and passive device integration on backside of die".
- Namishia; Daniel - Wake Forest NC
- Namishia; Daniel - Louisburg NC US
| Patent | Date |
|---|---|
| Methods For Pillar Connection On Frontside And Passive Device Integration On Backside Of Die App 20220208758 - Alcorn; Terry ; et al. | 2022-06-30 |
| Methods For Pillar Connection On Frontside And Passive Device Integration On Backside Of Die App 20210375856 - Alcorn; Terry ; et al. | 2021-12-02 |
| Semiconductor Die With Improved Ruggedness App 20210043530 - Hardiman; Chris ; et al. | 2021-02-11 |
| Semiconductor die with improved ruggedness Grant 10,886,189 - Hardiman , et al. January 5, 2 | 2021-01-05 |
| Semiconductor die with improved ruggedness Grant 10,840,162 - Hardiman , et al. November 17, 2 | 2020-11-17 |
| Semiconductor Die With Improved Ruggedness App 20190259682 - Hardiman; Chris ; et al. | 2019-08-22 |
| Semiconductor die with improved ruggedness Grant 10,332,817 - Hardiman , et al. | 2019-06-25 |
| Semiconductor Die With Improved Ruggedness App 20190172769 - Hardiman; Chris ; et al. | 2019-06-06 |
| Floating bond pad for power semiconductor devices Grant 10,068,834 - Haney , et al. September 4, 2 | 2018-09-04 |
| Stress mitigation for thin and thick films used in semiconductor circuitry Grant 9,934,983 - Ring , et al. April 3, 2 | 2018-04-03 |
| Encapsulation of advanced devices using novel PECVD and ALD schemes Grant 9,812,338 - Ring , et al. November 7, 2 | 2017-11-07 |
| PECVD protective layers for semiconductor devices Grant 9,761,439 - Ring , et al. September 12, 2 | 2017-09-12 |
| Pecvd Protective Layers For Semiconductor Devices App 20160172315 - Ring; Zoltan ; et al. | 2016-06-16 |
| Using stress reduction barrier sub-layers in a semiconductor die Grant 9,269,662 - Ring , et al. February 23, 2 | 2016-02-23 |
| Ohmic contact to semiconductor device Grant 9,214,352 - Hagleitner , et al. December 15, 2 | 2015-12-15 |
| Ni-rich Schottky contact Grant 9,202,703 - Hagleitner , et al. December 1, 2 | 2015-12-01 |
| Stress Mitigation For Thin And Thick Films Used In Semiconductor Circuitry App 20150221574 - Ring; Zoltan ; et al. | 2015-08-06 |
| Encapsulation Of Advanced Devices Using Novel Pecvd And Ald Schemes App 20140264960 - Ring; Zoltan ; et al. | 2014-09-18 |
| Floating Bond Pad For Power Semiconductor Devices App 20140246790 - Haney; Sarah Kay ; et al. | 2014-09-04 |
| Ni-rich Schottky Contact App 20140124792 - Hagleitner; Helmut ; et al. | 2014-05-08 |
| Using Stress Reduction Barrier Sub-layers In A Semiconductor Die App 20140103363 - Ring; Zoltan ; et al. | 2014-04-17 |
| Ohmic Contact To Semiconductor Device App 20120175682 - Hagleitner; Helmut ; et al. | 2012-07-12 |
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