Namioka; Shinichi
Patent Applications and Registrations
Patent applications and USPTO patent grants for Namioka; Shinichi.The latest application filed is for "waste fluid treatment apparatus".
- Namioka; Shinichi - Tokyo JP
| Patent | Date |
|---|---|
| Protective sheet disposing method Grant 11,298,928 - Mori , et al. April 12, 2 | 2022-04-12 |
| Waste fluid treatment apparatus Grant 11,040,889 - Namioka June 22, 2 | 2021-06-22 |
| Protective member forming apparatus Grant 10,916,459 - Namioka February 9, 2 | 2021-02-09 |
| Waste Fluid Treatment Apparatus App 20200223713 - NAMIOKA; Shinichi | 2020-07-16 |
| Protective Member Forming Apparatus App 20200043754 - NAMIOKA; Shinichi | 2020-02-06 |
| Protective Sheet Disposing Method App 20190308399 - MORI; Takashi ; et al. | 2019-10-10 |
| Grinding apparatus Grant 9,314,895 - Mori , et al. April 19, 2 | 2016-04-19 |
| Grinding Apparatus App 20150158137 - Mori; Takashi ; et al. | 2015-06-11 |
| Flip chip bonder Grant 7,222,772 - Arai , et al. May 29, 2 | 2007-05-29 |
| Method for manufacturing semiconductor chip Grant 7,172,950 - Takezoe , et al. February 6, 2 | 2007-02-06 |
| Semiconductor wafer protective device and semiconductor wafer treatment method Grant 6,943,045 - Kitamura , et al. September 13, 2 | 2005-09-13 |
| Wafer support plate Grant 6,927,416 - Arai , et al. August 9, 2 | 2005-08-09 |
| Machine for processing electrodes formed on a plate-like workpiece App 20040208718 - Arai, Kazuhisa ; et al. | 2004-10-21 |
| Flip chip bonder App 20040206800 - Arai, Kazuhisa ; et al. | 2004-10-21 |
| Method for manufacturing semiconductor chip App 20040192012 - Takezoe, Kouji ; et al. | 2004-09-30 |
| Wafer support plate App 20040124413 - Arai, Kazuhisa ; et al. | 2004-07-01 |
| Method of processing a semiconductor wafer App 20040092108 - Yajima, Kouichi ; et al. | 2004-05-13 |
| Chuck table Grant 6,382,609 - Namioka , et al. May 7, 2 | 2002-05-07 |
| Cutting-and-transferring system and pellet transferring apparatus App 20010040197 - Sekiya, Kazuma ; et al. | 2001-11-15 |
| Method of cutting and separating a bent board into individual small divisions Grant 6,286,499 - Yoshii , et al. September 11, 2 | 2001-09-11 |
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