Nam; Wong Kwet
Patent Applications and Registrations
Patent applications and USPTO patent grants for Nam; Wong Kwet.The latest application filed is for "stitch bump stacking design for overall package size reduction for multiple stack".
- Nam; Wong Kwet - Penang MY
| Patent | Date |
|---|---|
| Method and system for thin multi chip stack package with film on wire and copper wire Grant 8,680,686 - Chin , et al. March 25, 2 | 2014-03-25 |
| Stitch bump stacking design for overall package size reduction for multiple stack Grant 8,357,563 - Chin , et al. January 22, 2 | 2013-01-22 |
| Stitch Bump Stacking Design For Overall Package Size Reduction For Multiple Stack App 20120038059 - CHIN; Lai Nguk ; et al. | 2012-02-16 |
| Method And System For Thin Multi Chip Stack Package With Film On Wire And Copper Wire App 20110316158 - CHIN; Lai Nguk ; et al. | 2011-12-29 |
| Process applying die attach film to singulated die Grant 7,799,612 - Foong , et al. September 21, 2 | 2010-09-21 |
| Method and apparatus for handling thin semiconductor wafers Grant 7,157,376 - Foong , et al. January 2, 2 | 2007-01-02 |
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