Nam; Tae-Duk

Patent Applications and Registrations

Patent applications and USPTO patent grants for Nam; Tae-Duk.The latest application filed is for "semiconductor package having supporting plate and method of forming the same".

Company Profile

0.3.9

Nam; Tae-Duk - Seoul KR
Nam; Tae-Duk - Suwon-si N/A KR
NAM; Tae-Duk - Chungcheongnam-do KR
Nam; Tae-Duk - Asan-city KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor Package Having Supporting Plate And Method Of Forming The Same App 20140167291 - Nam; Tae-Duk ; et al.	2014-06-19
Semiconductor package having supporting plate and method of forming the same Grant 8,674,494 - Nam , et al. March 18, 2	2014-03-18
Semiconductor Package Having Supporting Plate And Method Of Forming The Same App 20130049228 - NAM; Tae-Duk ; et al.	2013-02-28
Stack Package And Method Of Fabricating The Same App 20090051023 - NAM; Tae-Duk ; et al.	2009-02-26
Lead on chip semiconductor package Grant 7,414,303 - Lee , et al. August 19, 2	2008-08-19
Adhesive Sheet, Semiconductor Device Having The Same, Multi-stacked Package Having The Same, And Methods Of Manufacturing A Semiconductor Device And A Multi-stacked Package App 20070138605 - Nam; Tae-Duk ; et al.	2007-06-21
Flip chip package having protective cap and method of fabricating the same App 20060255471 - Lee; Yong-Kwan ; et al.	2006-11-16
Lead on chip semiconductor package App 20050212099 - Lee, Sang-Hyeop ; et al.	2005-09-29
Flip chip package having protective cap and method of fabricating the same App 20040245653 - Lee, Yong-Kwan ; et al.	2004-12-09

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