Nam; Shi-baek

Patent Applications and Registrations

Patent applications and USPTO patent grants for Nam; Shi-baek.The latest application filed is for "semiconductor package suitable for high voltage applications".

Company Profile

0.7.7

Nam; Shi-baek - Buceon-si KR
Nam; Shi-baek - Bucheon-city KR
Nam; Shi-baek - Bucheon KR
Nam; Shi-baek - Incheon KR
Nam, Shi-baek - Incheon-city KR
Nam; Shi-baek - Inchun KR
Nam; Shi-baek - Inchon KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Molded leadless package having a partially exposed lead frame pad Grant 7,315,077 - Choi , et al. January 1, 2	2008-01-01
Semiconductor Package Suitable For High Voltage Applications App 20070181984 - Son; Joon-seo ; et al.	2007-08-09
Semiconductor package suitable for high voltage applications Grant 7,199,461 - Son , et al. April 3, 2	2007-04-03
Molded leadless package having improved reliability and high thermal transferability, and sawing type molded leadless package and method of manufacturing the same App 20050104168 - Choi, Yoon-hwa ; et al.	2005-05-19
Semiconductor package suitable for high voltage applications App 20040232541 - Son, Joon-seo ; et al.	2004-11-25
Power device having multi-chip package structure Grant 6,756,689 - Nam , et al. June 29, 2	2004-06-29
Apparatus for die bonding Grant 6,742,561 - Nam , et al. June 1, 2	2004-06-01
Thin, small-sized power semiconductor package Grant 6,621,152 - Choi , et al. September 16, 2	2003-09-16
Power device having multi-chip package structure App 20030102489 - Nam, Shi-baek ; et al.	2003-06-05
Apparatus for die bonding App 20020109217 - Nam, Shi Baek ; et al.	2002-08-15
Thin, small-sized power semiconductor package App 20020074634 - Choi, Yoon-Hwa ; et al.	2002-06-20
Semiconductor package App 20010045634 - Nam, Shi-Baek ; et al.	2001-11-29
Semiconductor package structures using epoxy molding compound pads and a method for fabricating the epoxy molding compound pads Grant 6,025,651 - Nam February 15, 2	2000-02-15
Structure of a semiconductor package including chips bonded to die bonding pad with conductive adhesive and chips bonded with non-conductive adhesive containing insulating beads Grant 5,965,947 - Nam , et al. October 12, 1	1999-10-12

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