NAM; Seo Woo

Patent Applications and Registrations

Patent applications and USPTO patent grants for NAM; Seo Woo.The latest application filed is for "semiconductor device and method for fabricating the same".

Company Profile

5.13.20

NAM; Seo Woo - Seoul KR
Nam; Seo-Woo - Gyeonggi-do KR
NAM; Seo-Woo - Yongin-si KR
Nam; Seo-Woo - Yogin-si KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor Device And Method For Fabricating The Same App 20220262739 - KIM; Seon Bae ; et al.	2022-08-18
Fuse structure having air dummy fuses and semiconductor device including the same Grant 10,727,181 - Kim , et al.	2020-07-28
E-fuse for use in semiconductor device Grant 10,700,060 - Kim , et al.	2020-06-30
E-fuse for use in semiconductor device Grant 10,685,913 - Kim , et al.	2020-06-16
Fuse of semiconductor device and method for forming the same Grant 10,607,934 - Kim , et al.	2020-03-31
E-fuse For Use In Semiconductor Device App 20200066717 - KIM; Deok-kee ; et al.	2020-02-27
Anti-fuse for use in semiconductor device Grant 10,497,700 - Kim , et al. De	2019-12-03
Fuse Structure And Semiconductor Device Including The Same App 20190109089 - KIM; Jae-Hong ; et al.	2019-04-11
Anti-fuse For Use In Semiconductor Device App 20190088647 - KIM; Deok-kee ; et al.	2019-03-21
E-fuse For Use In Semiconductor Device App 20190088646 - KIM; Deok-kee ; et al.	2019-03-21
E-fuse For Use In Semiconductor Device App 20190088596 - KIM; Deok-kee ; et al.	2019-03-21
E-fuse For Use In Semiconductor Device App 20190088597 - KIM; Deok-kee ; et al.	2019-03-21
Fuse structure having multiple air dummy fuses Grant 10,163,782 - Kim , et al. Dec	2018-12-25
Fuse Of Semiconductor Device And Method For Forming The Same App 20180301411 - KIM; Deok-Kee ; et al.	2018-10-18
Fuse Structure And Semiconductor Device Including The Same App 20170309567 - KIM; Jae-Hong ; et al.	2017-10-26
Fuse structure having multiple air dummy fuses Grant 9,735,104 - Kim , et al. August 15, 2	2017-08-15
Fuse Structure Having Multiple Air Dummy Fuses App 20170229395 - KIM; Jae-Hong ; et al.	2017-08-10
Method Of Forming Fine Patterns Of Semiconductor Device App 20110201202 - CHANG; Chong-Kwang ; et al.	2011-08-18
Method of fabricating semiconductor device Grant 7,972,958 - Lee , et al. July 5, 2	2011-07-05
Semiconductor devices including multiple stress films in interface area Grant 7,902,609 - Nam , et al. March 8, 2	2011-03-08
Methods of forming integrated circuit devices having tensile and compressive stress layers therein and devices formed thereby Grant 7,785,951 - Nam , et al. August 31, 2	2010-08-31
Semiconductor device and method of fabricating the same Grant 7,759,185 - Nam , et al. July 20, 2	2010-07-20
Method of fabricating semiconductor integrated circuit device App 20100173497 - Chang; Chong-Kwang ; et al.	2010-07-08
Semiconductor Devices Including Multiple Stress Films in Interface Area App 20100065919 - Nam; Seo-woo ; et al.	2010-03-18
Methods of producing semiconductor devices including multiple stress films in interface area Grant 7,642,148 - Nam , et al. January 5, 2	2010-01-05
Method of fabricating semiconductor device App 20090280645 - Lee; Jung-hoon ; et al.	2009-11-12
Semiconductor device and method of fabricating the same App 20080272436 - Nam; Seo-woo ; et al.	2008-11-06
Semiconductor Devices Including Multiple Stress Films In Interface Area And Methods Of Producing The Same App 20080079087 - Nam; Seo-woo ; et al.	2008-04-03
Methods of Forming Integrated Circuit Devices Having Tensile and Compressive Stress Layers Therein and Devices Formed Thereby App 20080081476 - Nam; Seo-woo ; et al.	2008-04-03
Method of Fabricating Semiconductor Device Having Dual Stress Liner App 20080081406 - Choo; Jae-ouk ; et al.	2008-04-03
Method of forming a via contact structure using a dual damascene process Grant 7,307,014 - Kim , et al. December 11, 2	2007-12-11
Semiconductor device having an insulating layer and method of fabricating the same App 20070178644 - Koo; Ja-eung ; et al.	2007-08-02
Method of forming a via contact structure using a dual damascene process App 20060003574 - Kim; Jae-Hak ; et al.	2006-01-05

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