Nam; Ki-Heum

Patent Applications and Registrations

Patent applications and USPTO patent grants for Nam; Ki-Heum.The latest application filed is for "photo mask set for forming multi-layered interconnection lines and semiconductor device fabricated using the same".

Company Profile

0.5.4

Nam; Ki-Heum - Gyeonggi-do KR
NAM; Ki-Heum - Seoul KR
Nam; Ki-heum - Suwon KR
Nam, Ki-Heum - Suwon-City KR
Nam; Ki-heum - Kyungki-do KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Photo mask set for forming multi-layered interconnection lines and semiconductor device fabricated using the same Grant 8,103,976 - Kim , et al. January 24, 2	2012-01-24
Photo Mask Set For Forming Multi-layered Interconnection Lines And Semiconductor Device Fabricated Using The Same App 20070273029 - KIM; Sung-Jin ; et al.	2007-11-29
Photo mask set for forming multi-layered interconnection lines and semiconductor device fabricated using the same Grant 7,271,492 - Kim , et al. September 18, 2	2007-09-18
Method Of Fabricating A Semiconductor Device Having A Hydrogen Source Layer App 20070161258 - NAM; Ki-Heum ; et al.	2007-07-12
Photo mask set for forming multi-layered interconnection lines and semiconductor device fabricated using the same App 20040155346 - Kim, Sung-Jin ; et al.	2004-08-12
Process tube having slit type process gas injection portion and hole type waste gas exhaust portion, and apparatus for fabricating semiconductor device Grant 6,402,849 - Kwag , et al. June 11, 2	2002-06-11
Process tube having slit type process gas injection portion and hole type waste gas exhaust portion, and apparatus for fabricating semiconductor device App 20010050054 - Kwag, Gyu-Hwan ; et al.	2001-12-13
Diffusion system having air curtain formation function for manufacturing semiconductor devices and method of controlling the same Grant 6,302,962 - Nam , et al. October 16, 2	2001-10-16
Semiconductor wafer boat with reduced wafer contact area Grant 6,099,302 - Hong , et al. August 8, 2	2000-08-08

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