Nam; Hyung-Woo

Patent Applications and Registrations

Patent applications and USPTO patent grants for Nam; Hyung-Woo.The latest application filed is for "method for cutting substrate using coolant".

Company Profile

0.4.8

Nam; Hyung-Woo - Yongin-si KR
Nam, Hyung-Woo - Gyeonggi-do KR
Nam, Hyung-Woo - Suii-eup Yongin-si KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method for cutting an LCD substrate using coolant having low surface tension and low viscosity properties in which a partial cut, cooling with coolant and then a full cut takes place after coolant is removed Grant 7,542,125 - Kim , et al. June 2, 2	2009-06-02
Method for cutting substrate using coolant App 20060065647 - Kim; Gi-Heon ; et al.	2006-03-30
Method and apparatus for cutting a substrate into multiple pieces with a single irradiation of a laser beam App 20040262273 - Nam, Hyung-Woo ; et al.	2004-12-30
Method and apparatus for cutting a substrate into multiple pieces with a single irradiation of a laser beam Grant 6,770,842 - Nam , et al. August 3, 2	2004-08-03
Method for cutting a non-metallic substrate Grant 6,713,720 - Jeon , et al. March 30, 2	2004-03-30
Apparatus for cutting a non-metallic substrate using a laser beam App 20040056008 - Choo, Dae-Ho ; et al.	2004-03-25
Method and apparatus for cutting a non-metallic substrate using a laser beam Grant 6,653,210 - Choo , et al. November 25, 2	2003-11-25
Method for cutting a non-metallic substrate App 20030062348 - Jeon, Baek-Kyun ; et al.	2003-04-03
Method and apparatus for cutting substrate using coolant App 20030052098 - Kim, Gi-Heon ; et al.	2003-03-20
Method and apparatus for cutting a substrate into multiple pieces with a single irradiation of a laser beam App 20020195434 - Nam, Hyung-Woo ; et al.	2002-12-26
Method and apparatus for cutting a non-metallic substrate using a laser beam App 20020170896 - Choo, Dae-Ho ; et al.	2002-11-21
Method and apparatus for cutting a non-metal substrate by using a laser beam App 20020046997 - Nam, Hyung-Woo ; et al.	2002-04-25

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