Nam; Hyo Seung

Patent Applications and Registrations

Patent applications and USPTO patent grants for Nam; Hyo Seung.The latest application filed is for "printed circuit board and method of manufacturing the same".

Company Profile

0.3.21

Nam; Hyo Seung - Hwasung-si KR
Nam; Hyo Seung - Suwon-si KR
NAM; Hyo Seung - Hwasung KR
Nam; Hyo Seung - Suwon KR
Nam; Hyo Seung - Gyeonggi-do KR
Nam; Hyo-Seung - Hwaseong-si KR
Nam; Hyo Seung - Yongin KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Printed circuit board and method of manufacturing the same Grant 10,045,436 - Cho , et al. August 7, 2	2018-08-07
Composition for photoresist development and method of developing photoresist using the same Grant 9,235,129 - Lee , et al. January 12, 2	2016-01-12
Printed Circuit Board And Method Of Manufacturing The Same App 20150373833 - BAEK; Yong Ho ; et al.	2015-12-24
Embedded Coreless Substrate And Method For Manufacturing The Same App 20150342054 - BAEK; Yong Ho ; et al.	2015-11-26
Printed Circuit Board And Method Of Manufacturing The Same App 20150195902 - LEE; Eung Suek ; et al.	2015-07-09
Solder Resist Opening Structure And Circuit Board App 20150156860 - LEE; Chang Bo ; et al.	2015-06-04
Printed Circuit Board And Method Of Manufacturing The Same App 20150129293 - CHO; Suk Hyeon ; et al.	2015-05-14
Multilayer Printed Circuit Board App 20150107880 - KIM; Hye Jin ; et al.	2015-04-23
Composition For Photoresist Development And Method Of Developing Photoresist Using The Same App 20140370446 - Lee; Chang Bo ; et al.	2014-12-18
Method Of Manufacturing Printed Circuit Board App 20140166355 - Hong; Suk Gi ; et al.	2014-06-19
Basket Jig For Electroless Plating Apparatus And Electroless Plating Method App 20140099433 - NAM; Hyo Seung ; et al.	2014-04-10
Method Of Forming Gold Thin Film And Printed Circuit Board App 20140076618 - CHO; Seong Min ; et al.	2014-03-20
Electro-copper Plating Apparatus App 20140069805 - NAM; Hyo Seung ; et al.	2014-03-13
Nickel Plating Solution And Method For Forming Nickel Plating Layer Using The Same App 20140069816 - KIM; Mi Geum ; et al.	2014-03-13
Via Hole Plating Method And Printed Circuit Board Manufactured Using The Same App 20130140074 - Yang; Jae Joon ; et al.	2013-06-06
Plating method of substrate and manufacturing method of circuit board using the same App 20120123574 - Moon; Jeong-Ho ; et al.	2012-05-17
Method for forming a plating layer and method for manufacturing a circuit board using the same App 20120031550 - Moon; Jeong-Ho ; et al.	2012-02-09
Apparatus and method for measuring activity of plating solution App 20110241709 - Lyu; Young Ku ; et al.	2011-10-06
Solution For Inhibiting Palladium Activity Including Halogenic Acid And Method For Preventing Defect Of Plating Using Thereof App 20110135811 - Kwon; Hyuk-Jin ; et al.	2011-06-09
Method for cleaning metal nanoparticles Grant 7,879,153 - Seo , et al. February 1, 2	2011-02-01
Method For Preparing Nickel Nanoparticles App 20100031775 - Seo; Jung Wook ; et al.	2010-02-11
Method for manufacturing package on package with cavity App 20100006446 - Kim; Chi-Seong ; et al.	2010-01-14
Preparing Method Of Tin Sulfide Nanoparticles And Manufacturing Method Of Lithium Ion Battery Using The Same App 20090029258 - SEO; Jung Wook ; et al.	2009-01-29
Printed circuit board having inner via hole and manufacturing method thereof App 20070199735 - Kim; Chi-Seong ; et al.	2007-08-30

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