Nalla; Ravi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Nalla; Ravi.The latest application filed is for "enhanced lens assembly".

Company Profile

0.15.17

Nalla; Ravi - San Jose CA US
Nalla; Ravi - Chandler AZ US

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Mechanical adhesion of copper metallization to dielectric with partially cured epoxy fillers Grant 9,929,097 - Nalla , et al. March 27, 2	2018-03-27
Enhanced Lens Assembly App 20170276897 - Nalla; Ravi ; et al.	2017-09-28
Enhanced camera module mount Grant 9,726,962 - Nalla , et al. August 8, 2	2017-08-08
Mechanical Adhesion Of Copper Metallization To Dielectric With Partially Cured Epoxy Fillers App 20160079174 - Nalla; Ravi ; et al.	2016-03-17
Mechanical adhesion of copper metallization to dielectric with partially cured epoxy fillers Grant 9,040,842 - Nalla , et al. May 26, 2	2015-05-26
Forming in-situ micro-feature structures with coreless packages Grant 8,772,924 - Nalla , et al. July 8, 2	2014-07-08
Mechanical Adhesion Of Copper Metallization To Dielectric With Partially Cured Epoxy Fillers App 20130299226 - Nalla; Ravi ; et al.	2013-11-14
Forming In-situ Micro-feature Structures With Coreless Packages App 20130214403 - Nalla; Ravi ; et al.	2013-08-22
Mechanical adhesion of copper metallization to dielectric with partially cured epoxy fillers Grant 8,425,785 - Nalla , et al. April 23, 2	2013-04-23
Method of forming solder bumps on substrates Grant 8,252,677 - Bchir , et al. August 28, 2	2012-08-28
Method of forming collapse chip connection bumps on a semiconductor substrate Grant 7,985,622 - Nalla , et al. July 26, 2	2011-07-26
Optical die structures and associated package substrates Grant 7,831,115 - Bchir , et al. November 9, 2	2010-11-09
Method of enabling solder deposition on a substrate and electronic package formed thereby Grant 7,825,022 - Nalla , et al. November 2, 2	2010-11-02
Method Of Forming Collapse Chip Connection Bumps On A Semiconductor Substrate App 20100044862 - Nalla; Ravi ; et al.	2010-02-25
Microball attachment using self-assembly for substrate bumping Grant 7,651,021 - Supriya , et al. January 26, 2	2010-01-26
Method of enabling solder deposition on a substrate and electronic package formed thereby App 20090277866 - NALLA; RAVI ; et al.	2009-11-12
Mechanical Adhesion Of Copper Metallization To Dielectric With Partially Cured Epoxy Fillers App 20090242109 - Nalla; Ravi ; et al.	2009-10-01
Optical Die Structures And Associated Package Substrates App 20090238233 - Bchir; Omar ; et al.	2009-09-24
Substrates For Optical Die Structures App 20090238516 - Bchir; Omar J. ; et al.	2009-09-24
Substrates for optical die structures Grant 7,583,871 - Bchir , et al. September 1, 2	2009-09-01
Microball Attachment Using Self-assembly For Substrate Bumping App 20090166396 - SUPRIYA; Lakshmi ; et al.	2009-07-02
Method of enabling solder deposition on a substrate and electronic package formed thereby Grant 7,538,429 - Nalla , et al. May 26, 2	2009-05-26
Method Of Forming Solder Bumps On Substrates App 20090085206 - Bchir; Omar ; et al.	2009-04-02
Method of enabling solder deposition on a substrate and electronic package formed thereby App 20080042248 - Nalla; Ravi ; et al.	2008-02-21
Method of providing solder bumps of mixed sizes on a substrate using solder transfer in two stages App 20080003804 - Nalla; Ravi ; et al.	2008-01-03

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