Nakazawa; Masao
Patent Applications and Registrations
Patent applications and USPTO patent grants for Nakazawa; Masao.The latest application filed is for "heat radiation component and method for manufacturing heat radiation component".
Company Profile
0.25.20
- Nakazawa; Masao - Nagano N/A JP
- Nakazawa; Masao - Kanagawa JP
- Nakazawa; Masao - Nagano-shi JP
- Nakazawa; Masao - Hokkaido JP
- Nakazawa, Masao - Yokohama-shi JP
- Nakazawa, Masao - Nagao-shi JP
- Nakazawa; Masao - Ageo JP
- Nakazawa; Masao - Takatsuki JP
- Nakazawa; Masao - Nagaokakyo JP
Patent Activity
| Patent | Date |
|---|---|
| Composite plating liquid Grant 9,476,138 - Suwa , et al. October 25, 2 | 2016-10-25 |
| Heat radiating component and method of producing same Grant 9,136,200 - Suwa , et al. September 15, 2 | 2015-09-15 |
| Heat Radiation Component And Method For Manufacturing Heat Radiation Component App 20140034282 - KAWAMURA; Kenji ; et al. | 2014-02-06 |
| Electroless Plated Film Including Phosphorus, Boron And Carbon Nanotube App 20140030504 - KAWAMURA; Kenji ; et al. | 2014-01-30 |
| Portable information terminal, display control device, display control method, and computer readable program therefor Grant 8,375,334 - Nakano , et al. February 12, 2 | 2013-02-12 |
| Wiring board Grant 8,362,369 - Horiuchi , et al. January 29, 2 | 2013-01-29 |
| Composite Plating Liquid App 20120216997 - Suwa; Yoriyuki ; et al. | 2012-08-30 |
| Heat Radiating Component And Method Of Producing Same App 20120064361 - SUWA; Yoriyuki ; et al. | 2012-03-15 |
| Method of manufacturing semiconductor device Grant 7,901,997 - Ozawa , et al. March 8, 2 | 2011-03-08 |
| Wiring Board App 20100307808 - HORIUCHI; Michio ; et al. | 2010-12-09 |
| Solder bump forming method Grant 7,807,560 - Imafuji , et al. October 5, 2 | 2010-10-05 |
| Regeneration process of alkaline permanganate etching solution and unit therefor Grant 7,695,638 - Nakamura , et al. April 13, 2 | 2010-04-13 |
| Solder Bump Forming Method App 20090023281 - Imafuji; Kei ; et al. | 2009-01-22 |
| Method of manufacturing radiating plate and semiconductor apparatus using the same Grant 7,445,965 - Akagawa , et al. November 4, 2 | 2008-11-04 |
| Method Of Manufacturing Semiconductor Device App 20080188040 - Ozawa; Takashi ; et al. | 2008-08-07 |
| Silver electroplating solution Grant 7,402,232 - Ogihara , et al. July 22, 2 | 2008-07-22 |
| Regeneration Process Of Alkaline Permanganate Etching Solution And Unit Therefor App 20080124258 - Nakamura; Norikazu ; et al. | 2008-05-29 |
| Non-cyanide electroless gold plating solution and process for electroless gold plating Grant 7,264,848 - Sanada , et al. September 4, 2 | 2007-09-04 |
| Handrail Grant 7,093,825 - Kawamura , et al. August 22, 2 | 2006-08-22 |
| electrolytic silver plating solution App 20060060474 - Ogihara; Yoko ; et al. | 2006-03-23 |
| Non-cyanide electroless gold plating solution and process for electroless gold plating App 20060062927 - Sanada; Masaki ; et al. | 2006-03-23 |
| Copper strike plating bath App 20060027462 - Ogihara; Yoko ; et al. | 2006-02-09 |
| Method of manufacturing radiating plate and semiconductor apparatus using the same App 20050221536 - Akagawa, Masatoshi ; et al. | 2005-10-06 |
| Electrolytic stripping method App 20050139488 - Ogihara, Yoko ; et al. | 2005-06-30 |
| Electrolytic copper-stripping liquid and electrolytic stripping method App 20050126926 - Ogihara, Yoko ; et al. | 2005-06-16 |
| Information terminal and program for processing displaying information used for the same App 20050003870 - Nakano, Masao ; et al. | 2005-01-06 |
| Personal digital assistant and program used therefor App 20040222975 - Nakano, Masao ; et al. | 2004-11-11 |
| Personal digital assistant and program for controlling used for the same App 20040164973 - Nakano, Masao ; et al. | 2004-08-26 |
| Method of plating for filling via holes Grant 6,755,957 - Nakamura , et al. June 29, 2 | 2004-06-29 |
| Portable information terminal, display control device, display control method, and computer readable program therefor App 20040100479 - Nakano, Masao ; et al. | 2004-05-27 |
| Handrail App 20030193048 - Kawamura, Osamu ; et al. | 2003-10-16 |
| Substitutional electroless gold plating solution, electroless gold plating method and semiconductor device Grant 6,398,856 - Nakazawa June 4, 2 | 2002-06-04 |
| Method of plating for filling via holes App 20010013472 - Nakamura, Kenji ; et al. | 2001-08-16 |
| Lead frame and method for manufacturing same Grant 5,909,053 - Fukase , et al. June 1, 1 | 1999-06-01 |
| Vehicle braking force controller Grant 5,772,289 - Nakazawa , et al. June 30, 1 | 1998-06-30 |
| Lead frame and method for manufacturing same Grant 5,656,855 - Fukase , et al. August 12, 1 | 1997-08-12 |
| Lead frame and method for manufacturing same Grant 5,643,433 - Fukase , et al. July 1, 1 | 1997-07-01 |
| Tape automated bonding in semiconductor technique Grant 5,384,204 - Yumoto , et al. January 24, 1 | 1995-01-24 |
| Sealed lead acid battery Grant 4,576,879 - Nakazawa , et al. March 18, 1 | 1986-03-18 |
| Composite image display apparatus Grant 4,249,211 - Baba , et al. February 3, 1 | 1981-02-03 |
| Television receiver for display of plural video images including a displayed boundary between the images Grant 4,238,773 - Tsuboka , et al. December 9, 1 | 1980-12-09 |
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