loadpatents
name:-0.022382020950317
name:-0.021955966949463
name:-0.0017838478088379
NAKAYOSHI; Kazumi Patent Filings

NAKAYOSHI; Kazumi

Patent Applications and Registrations

Patent applications and USPTO patent grants for NAKAYOSHI; Kazumi.The latest application filed is for "laminated structure, method of preparing same, and method of fabricating electronic device using laminated structure".

Company Profile
0.24.21
  • NAKAYOSHI; Kazumi - Yokohama JP
  • Nakayoshi; Kazumi - Sodegaura-shi JP
  • Nakayoshi; Kazumi - Sodegaura JP
  • Nakayoshi; Kazumi - Chiba JP
  • Nakayoshi; Kazumi - Sodegaura-city JP
  • Nakayoshi; Kazumi - Ichihara-shi JP
  • Nakayoshi; Kazumi - Sodeguara JP
  • Nakayoshi; Kazumi - Chiba Prefecture JP
  • Nakayoshi; Kazumi - Ichihara JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Laminated Structure, Method of Preparing Same, and Method of Fabricating Electronic Device Using Laminated Structure
App 20150151514 - KIKUCHI; Tomoyuki ;   et al.
2015-06-04
Thermally Conductive Silicone Composition
App 20150097138 - Kato; Tomoko ;   et al.
2015-04-09
Thermally conductive silicone grease composition
Grant 8,912,132 - Kato , et al. December 16, 2
2014-12-16
Thermally conductive silicone grease composition
Grant 8,796,190 - Kato , et al. August 5, 2
2014-08-05
Thermally conductive silicone composition and electronic device
Grant 8,633,276 - Domae , et al. January 21, 2
2014-01-21
Sealant or filler for electrical and electronic components, and electrical and electrical components
Grant 8,546,508 - Nabeta , et al. October 1, 2
2013-10-01
Thermally Conductive Silicone Grease Composition
App 20130137613 - Kato; Tomoko ;   et al.
2013-05-30
Thermally Conductive Silicone Rubber Composition
App 20120292558 - Kodama; Harumi ;   et al.
2012-11-22
Thermally Conductive Silicone Grease Composition
App 20120280169 - Kato; Tomoko ;   et al.
2012-11-08
Sealant Or Filler For Electrical And Electronic Components, And Electrical And Electronic Components
App 20110245426 - Nabeta; Akiko ;   et al.
2011-10-06
Thermally Conductive Silicone Composition And Electronic Device
App 20110188213 - Domae; Narumasa ;   et al.
2011-08-04
Electronic Device And Method Of Manufacturing The Same
App 20110180938 - HIRASAWA; Kazuya ;   et al.
2011-07-28
Thermally Conductive Silicone Composition And Semiconductor Device
App 20110163460 - Kato; Tomoko ;   et al.
2011-07-07
Thermally Conductive Silicone Grease Composition
App 20110039738 - Nakayoshi; Kazumi ;   et al.
2011-02-17
Silver-based Powder, Method Of Preparation Thereof, And Curable Silicone Composition
App 20100155653 - Nakayoshi; Kazumi ;   et al.
2010-06-24
Silver-based powder, method of preparation thereof, and curable silicone composition
Grant 7,700,678 - Nakayoshi , et al. April 20, 2
2010-04-20
Electrically conductive silicone rubber composition
Grant 7,537,712 - Shima , et al. May 26, 2
2009-05-26
Thermoconductive curable liquid polymer composition and semiconductor device produced with the use of this composition
Grant 7,375,158 - Ishikawa , et al. May 20, 2
2008-05-20
Metal Base Circuit Substrate For An Optical Device And Method Manufacturing The Aforementioned Substrate
App 20070292697 - Nakayoshi; Kazumi ;   et al.
2007-12-20
Silver-filled electrically conductive organosiloxane compositions
Grant 7,074,849 - Nakayoshi , et al. July 11, 2
2006-07-11
Anisotropically electroconductive adhesive film, method for the production thereof, and semiconductor devices
Grant 7,056,129 - Kobayashi , et al. June 6, 2
2006-06-06
Silver-based powder, method of preparation thereof, and curable silicone composition
App 20060047043 - Nakayoshi; Kazumi ;   et al.
2006-03-02
Electrically conductive silicone rubber composition
App 20050239940 - Shima, Ryoto ;   et al.
2005-10-27
Thermoconductive curable liquid polymer composition and semiconductor device produced with the use of this composition
App 20050181213 - Ishikawa, Hiroki ;   et al.
2005-08-18
Anisotropically electroconductive adhesive film, method for the production thereof, and semiconductor devices
App 20050118845 - Kobayashi, Akihiko ;   et al.
2005-06-02
Silver-filled electrically conductive organosiloxane compositions
App 20040192834 - Nakayoshi, Kazumi ;   et al.
2004-09-30
Alkenyl polyorganosiloxane, organohydrogensiloxane, organosilicon or silane treated silver particles and Pt catalyst
Grant 6,797,772 - Nakayoshi , et al. September 28, 2
2004-09-28
Curable organopolysiloxane composition and method of manufacturing semiconductor devices with the use of the aforementioned composition
Grant 6,518,204 - Yamakawa , et al. February 11, 2
2003-02-11
Paste dispensing container
Grant 6,513,680 - Nakayoshi , et al. February 4, 2
2003-02-04
Curable organopolysiloxane composition and method of manufacturing semiconductor devices with the use of the aforementioned composition
App 20020160624 - Yamakawa, Kimio ;   et al.
2002-10-31
Silver-filled electrically conductive organosiloxane compositions
App 20020099114 - Nakayoshi, Kazumi ;   et al.
2002-07-25
Paste dispensing container
App 20020008123 - Nakayoshi, Kazumi ;   et al.
2002-01-24
Heat-conducting polymer composition
Grant 6,040,362 - Mine , et al. March 21, 2
2000-03-21
Electrically conductive silicone elastomer compositions, methods for manufacturing semiconductor devices, and semiconductor devices
Grant 6,039,831 - Mine , et al. March 21, 2
2000-03-21
Electrically conductive silicone compositions
Grant 6,017,587 - Kleyer , et al. January 25, 2
2000-01-25
Addition reaction-curing electrically conductive silicone composition and method for the preparation thereof
Grant 5,932,145 - Mitani , et al. August 3, 1
1999-08-03
Electrically conductive silicone elastomer compositions, methods for manufacturing semiconductor devices, and semiconductor devices
Grant 5,872,170 - Mine , et al. February 16, 1
1999-02-16
Curable organosiloxane compositions and semiconductor devices
Grant 5,804,631 - Mine , et al. September 8, 1
1998-09-08
Conductive adhesive and article made therewith
Grant 5,173,765 - Nakayoshi , et al. * December 22, 1
1992-12-22
Method of treating a hardened semiconductor resin encapsulated layer with ultraviolet radiation
Grant 5,036,024 - Mine , et al. July 30, 1
1991-07-30

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.

© 2024 USPTO.report | Privacy Policy | Resources | RSS Feed of Trademarks | Trademark Filings Twitter Feed