NAKAYAMA; Nobuaki
Patent Applications and Registrations
Patent applications and USPTO patent grants for NAKAYAMA; Nobuaki.The latest application filed is for "method of manufacturing heat spreader module".
- NAKAYAMA; Nobuaki - Obu-City JP
- Nakayama; Nobuaki - Obu JP
- Nakayama; Nobuaki - Handa-City JP
- Nakayama; Nobuaki - Handa JP
- Nakayama; Nobuaki - Tokai JP
- Nakayama; Nobuaki - Nagoya JP
- Nakayama, Nobuaki - Tokai-City JP
| Patent | Date |
|---|---|
| Method Of Manufacturing Heat Spreader Module App 20080272180 - ISHIKAWA; Takahiro ; et al. | 2008-11-06 |
| Heat spreader module Grant 7,433,187 - Ishikawa , et al. October 7, 2 | 2008-10-07 |
| Method Of Inspecting Laminated Assembly And Method Of Inspecting Heat Spreader Module App 20070183127 - ISHIKAWA; Shuhei ; et al. | 2007-08-09 |
| Heat spreader module Grant 7,161,807 - Ishikawa , et al. January 9, 2 | 2007-01-09 |
| Circuit board and method for producing the same App 20060191707 - Ishikawa; Takahiro ; et al. | 2006-08-31 |
| Method for producing a circuit board Grant 7,069,645 - Ishikawa , et al. July 4, 2 | 2006-07-04 |
| Composite material Grant 6,953,539 - Ishikawa , et al. October 11, 2 | 2005-10-11 |
| Heat sink material and method of manufacturing the heat sink material Grant 6,933,531 - Ishikawa , et al. August 23, 2 | 2005-08-23 |
| Heat sink material Grant 6,927,421 - Ishikawa , et al. August 9, 2 | 2005-08-09 |
| Heat spreader module App 20040207987 - Ishikawa, Takahiro ; et al. | 2004-10-21 |
| Heat spreader module and method of manufacturing same App 20040191558 - Ishikawa, Takahiro ; et al. | 2004-09-30 |
| Heat sink material App 20030082393 - Ishikawa, Shuhei ; et al. | 2003-05-01 |
| Composite material App 20030054188 - Ishikawa, Shuhei ; et al. | 2003-03-20 |
| Circuit board and method for producing the same App 20020138973 - Ishikawa, Takahiro ; et al. | 2002-10-03 |
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