Nakatsuka; Yasuo
Patent Applications and Registrations
Patent applications and USPTO patent grants for Nakatsuka; Yasuo.The latest application filed is for "dispersion method, redispersion method and crush method of dispersoids, and apparatuses therefor".
- Nakatsuka; Yasuo - Osaka JP
- Nakatsuka; Yasuo - Ibaraki-shi JP
- Nakatsuka; Yasuo - Ibaraki JP
- Nakatsuka; Yasuo - Tokyo JP
- Nakatsuka; Yasuo - Hyogo pref. JP
| Patent | Date |
|---|---|
| Composite material sheet and production method thereof App 20080102266 - Nakatsuka; Yasuo ; et al. | 2008-05-01 |
| Dispersion method, redispersion method and crush method of dispersoids, and apparatuses therefor App 20080103216 - Nakatsuka; Yasuo ; et al. | 2008-05-01 |
| Production method of anisotropic conductive sheet App 20060065995 - Masaki; Toshiaki ; et al. | 2006-03-30 |
| Flexible wiring board Grant 6,280,828 - Nakatsuka , et al. August 28, 2 | 2001-08-28 |
| Film carrier and laminate type mounting structure using same Grant 6,208,521 - Nakatsuka March 27, 2 | 2001-03-27 |
| Electrical connections using deforming compression Grant 6,015,081 - Okabayashi , et al. January 18, 2 | 2000-01-18 |
| Electrical connecting member Grant 5,860,818 - Sakaki , et al. January 19, 1 | 1999-01-19 |
| Ceramic substrate having a multilayered metallic thin film Grant 5,616,423 - Sanjyou , et al. April 1, 1 | 1997-04-01 |
| Method of manufacturing electrical connecting member Grant 5,600,884 - Kondo , et al. February 11, 1 | 1997-02-11 |
| Process for preparing electrical connecting member Grant 5,379,515 - Kondo , et al. January 10, 1 | 1995-01-10 |
| Process for preparing electrical connecting member Grant 5,145,552 - Yoshizawa , et al. September 8, 1 | 1992-09-08 |
| Process for preparing electrical connecting member Grant 5,135,606 - Kato , et al. August 4, 1 | 1992-08-04 |
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