Nakatsuka; Tetsuya
Patent Applications and Registrations
Patent applications and USPTO patent grants for Nakatsuka; Tetsuya.The latest application filed is for "sealing structure and manufacturing method thereof".
Company Profile
2.26.31
- Nakatsuka; Tetsuya - Tokyo JP
- Nakatsuka; Tetsuya - Yokohama JP
- Nakatsuka; Tetsuya - Kanagawa JP
- Nakatsuka; Tetsuya - Fujisawa JP
- Nakatsuka; Tetsuya - Fujisawa-shi JP
Patent Activity
| Patent | Date |
|---|---|
| Sealing structure and manufacturing method thereof Grant 11,244,877 - Nakatsuka , et al. February 8, 2 | 2022-02-08 |
| Sealing Structure and Manufacturing Method Thereof App 20200303272 - NAKATSUKA; Tetsuya ; et al. | 2020-09-24 |
| Pb-free solder-connected structure Grant 8,907,475 - Shimokawa , et al. December 9, 2 | 2014-12-09 |
| Manufacturing method for a head-stack assembly, apparatus for interconnection of the head-stack assembly, and head-stack assembly Grant 8,699,187 - Nakamura , et al. April 15, 2 | 2014-04-15 |
| Pb-FREE SOLDER-CONNECTED STRUCTURE App 20130286621 - SHIMOKAWA; Hanae ; et al. | 2013-10-31 |
| Pb-free solder-connected structure and electronic device Grant 8,503,189 - Shimokawa , et al. August 6, 2 | 2013-08-06 |
| Magnetic disk drive feed-through solder connection with solder fillet formed inside base and protruding outside base Grant 8,179,631 - Aoyagi , et al. May 15, 2 | 2012-05-15 |
| Solder composition for electronic devices Grant 8,022,551 - Soga , et al. September 20, 2 | 2011-09-20 |
| Soldering method and soldering apparatus Grant 8,020,747 - Nakatsuka , et al. September 20, 2 | 2011-09-20 |
| Manufacturing Method For A Head-stack Assembly, Apparatus For Interconnection Of The Head-stack Assembly, And Head-stack Assembly App 20110109996 - Nakamura; Tetsuya ; et al. | 2011-05-12 |
| Electronic component with varying rigidity leads using Pb-free solder Grant 7,911,062 - Nakatsuka , et al. March 22, 2 | 2011-03-22 |
| Magnetic Disk Device App 20100328815 - Nakatsuka; Tetsuya ; et al. | 2010-12-30 |
| Pb-free solder-connected structure and electronic device App 20100214753 - SHIMOKAWA; Hanae ; et al. | 2010-08-26 |
| Solder foil, semiconductor device and electronic device Grant 7,722,962 - Soga , et al. May 25, 2 | 2010-05-25 |
| Pb-free solder-connected structure and electronic device Grant 7,709,746 - Shimokawa , et al. May 4, 2 | 2010-05-04 |
| Soldering Method And Soldering Apparatus App 20100006624 - Nakatsuka; Tetsuya ; et al. | 2010-01-14 |
| Magnetic disk drive and soldering method of feed-through App 20080259503 - Aoyagi; Akihiko ; et al. | 2008-10-23 |
| Mounting Substrate Suitable for Use to Install Surface Mount Components App 20080261001 - Nakatsuka; Tetsuya ; et al. | 2008-10-23 |
| Mounting Structure App 20080062665 - NAKATSUKA; TETSUYA ; et al. | 2008-03-13 |
| Electronic Component With Lead Using Pb-free Solder App 20070210139 - NAKATSUKA; Tetsuya ; et al. | 2007-09-13 |
| Semiconductor device with lead-free solder Grant 7,259,465 - Soga , et al. August 21, 2 | 2007-08-21 |
| Solder composition for electronic devices App 20070031279 - Soga; Tasao ; et al. | 2007-02-08 |
| Semiconductor device having solder bumps reliably reflow solderable Grant 7,145,236 - Miura , et al. December 5, 2 | 2006-12-05 |
| Packaging method using lead-free solder Grant 7,131,566 - Nakatsuka , et al. November 7, 2 | 2006-11-07 |
| Reflow soldering method using Pb-free solder alloy and hybrid packaging method and structure App 20060239855 - Nakatsuka; Tetsuya ; et al. | 2006-10-26 |
| Electronic device App 20060145352 - Soga; Tasao ; et al. | 2006-07-06 |
| Pb-free solder-connected structure and electronic device App 20060115994 - Shimokawa; Hanae ; et al. | 2006-06-01 |
| Wave soldering method using lead-free solder, apparatus therefor, and wave-soldered assembly Grant 7,048,173 - Nakatsuka , et al. May 23, 2 | 2006-05-23 |
| Solder foil semiconductor device and electronic device App 20060061974 - Soga; Tasao ; et al. | 2006-03-23 |
| Method of producing an electronic device having a PB free solder connection Grant 7,013,564 - Shimokawa , et al. March 21, 2 | 2006-03-21 |
| Pb-free solder-connected structure and electronic device Grant 6,960,396 - Shimokawa , et al. November 1, 2 | 2005-11-01 |
| Solder Grant 6,872,465 - Soga , et al. March 29, 2 | 2005-03-29 |
| Electronic device Grant 6,774,490 - Soga , et al. August 10, 2 | 2004-08-10 |
| Electronic device App 20040007384 - Soga, Tasao ; et al. | 2004-01-15 |
| Solder App 20030224197 - Soga, Tasao ; et al. | 2003-12-04 |
| Packaging method using lead-free solder App 20030201310 - Nakatsuka, Tetsuya ; et al. | 2003-10-30 |
| Electron device and semiconductor device App 20030186072 - Soga, Tasao ; et al. | 2003-10-02 |
| Packaging method using lead-free solder Grant 6,585,149 - Nakatsuka , et al. July 1, 2 | 2003-07-01 |
| Wave soldering method using lead-free solder, apparatus therefor, and wave-soldered assembly App 20030116352 - Nakatsuka, Tetsuya ; et al. | 2003-06-26 |
| Product using Zn-Al alloy solder Grant 6,563,225 - Soga , et al. May 13, 2 | 2003-05-13 |
| Electron device and semiconductor device Grant 6,555,052 - Soga , et al. April 29, 2 | 2003-04-29 |
| Packaging method using lead-free solder App 20030034381 - Nakatsuka, Tetsuya ; et al. | 2003-02-20 |
| Semiconductor device having solder bumps reliably reflow solderable App 20030030149 - Miura, Kazuma ; et al. | 2003-02-13 |
| Semiconductor module having solder bumps and solder portions with different materials and compositions and circuit substrate Grant 6,486,411 - Miura , et al. November 26, 2 | 2002-11-26 |
| Electronic device App 20020171157 - Soga, Tasao ; et al. | 2002-11-21 |
| Pb-free solder-connected structure and electronic device App 20020163085 - Shimokawa, Hanae ; et al. | 2002-11-07 |
| Product using Zn-Al alloy solder App 20020149114 - Soga, Tasao ; et al. | 2002-10-17 |
| Electronic device App 20020114726 - Soga, Tasao ; et al. | 2002-08-22 |
| Electronic device App 20020100986 - Soga, Tasao ; et al. | 2002-08-01 |
| Electron device and semiconductor device App 20020066583 - Soga, Tasao ; et al. | 2002-06-06 |
| Pb-free solder-connected structure and electronic device App 20020019077 - Shimokawa, Hanae ; et al. | 2002-02-14 |
| Technical field App 20020009610 - Shimokawa, Hanae ; et al. | 2002-01-24 |
| Semiconductor module and circuit substrate App 20010050181 - Miura, Kazuma ; et al. | 2001-12-13 |
| Method and apparatus of manufacturing an electronic circuit board Grant 6,204,490 - Soga , et al. March 20, 2 | 2001-03-20 |
| Lead-free solder used for connecting electronic parts on organic substrate and electronic products made using same Grant 5,942,185 - Nakatsuka , et al. August 24, 1 | 1999-08-24 |
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