Nakatani; Ikuyoshi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Nakatani; Ikuyoshi.The latest application filed is for "breaking apparatus and breaking method for substrate made of brittle material".

Company Profile

0.8.3

Nakatani; Ikuyoshi - Suita JP
Nakatani; Ikuyoshi - Osaka N/A JP
Nakatani; Ikuyoshi - Suita-city JP
Nakatani; Ikuyoshi - Kyoto JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Breaking apparatus and breaking method for substrate made of brittle material Grant 8,899,459 - Kondo , et al. December 2, 2	2014-12-02
Processing method for a workpiece, dividing method for a workpiece, and laser processing apparatus Grant 8,536,024 - Nagatomo , et al. September 17, 2	2013-09-17
Breaking Apparatus And Breaking Method For Substrate Made Of Brittle Material App 20110266325 - Kondo; Noriyuki ; et al.	2011-11-03
Processing Method For A Workpiece, Dividing Method For A Workpiece, And Laser Processing Apparatus App 20110155706 - NAGATOMO; Shohei ; et al.	2011-06-30
Laser Processing Method, Method For Dividing Workpiece, And Laser Processing Apparatus App 20110100966 - NAGATOMO; Shohei ; et al.	2011-05-05
Method and apparatus for measuring insulation film thickness of semiconductor wafer Grant 5,568,252 - Kusuda , et al. October 22, 1	1996-10-22
Optical gap measuring device using frustrated internal reflection Grant 5,239,183 - Kouno , et al. August 24, 1	1993-08-24
Method of and apparatus for measuring electric characteristics of semiconductor wafer Grant 5,233,291 - Kouno , et al. August 3, 1	1993-08-03
Gap measuring device and method using frustrated internal reflection Grant 5,225,690 - Sakai , et al. July 6, 1	1993-07-06

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