Nakata; Yoshirou

Patent Applications and Registrations

Patent applications and USPTO patent grants for Nakata; Yoshirou.The latest application filed is for "wafer inspection device".

Company Profile

0.15.8

Nakata; Yoshirou - Tokyo JP
Nakata; Yoshirou - Kyoto JP
Nakata; Yoshirou - Souraku-gun JP
Nakata; Yoshirou - Nara JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Probe card and semiconductor wafer inspection method using the same Grant 8,659,312 - Nakata , et al. February 25, 2	2014-02-25
Wafer inspection device Grant 8,638,118 - Nakata , et al. January 28, 2	2014-01-28
Probe, electronic device test apparatus, and method of producing the same Grant 8,598,902 - Umemura , et al. December 3, 2	2013-12-03
Wafer Inspection Device App 20130147504 - NAKATA; Yoshirou ; et al.	2013-06-13
Wafer inspection device and semiconductor wafer inspection method using the same Grant 8,400,182 - Nakata , et al. March 19, 2	2013-03-19
Probe card, method of manufacturing the probe card and alignment method Grant 7,982,482 - Yamada , et al. July 19, 2	2011-07-19
Wafer Inspection Device And Semiconductor Wafer Inspection Method Using The Same App 20110095780 - NAKATA; Yoshirou ; et al.	2011-04-28
Probe Card And Semiconductor Wafer Inspection Method Using The Same App 20110074455 - NAKATA; Yoshirou ; et al.	2011-03-31
Probe card for semiconductor IC test and method of manufacturing the same Grant 7,768,285 - Sanada , et al. August 3, 2	2010-08-03
Semiconductor IC and testing method thereof Grant 7,673,205 - Miyake , et al. March 2, 2	2010-03-02
Probe card having a conductive thin film on the surface of an insulating film behind each of the alignment marks each marks comprises a plurality of second bumps Grant 7,589,543 - Yamada , et al. September 15, 2	2009-09-15
Probe Card, Method Of Manufacturing The Probe Card And Alignment Method App 20090183363 - Yamada; Kenji ; et al.	2009-07-23
Probe card for semiconductor IC test and method of manufacturing the same App 20080150563 - Sanada; Minoru ; et al.	2008-06-26
Semiconductor IC and testing method thereof App 20080098267 - Miyake; Naomi ; et al.	2008-04-24
Semiconductor wafer and testing method therefor Grant 7,170,189 - Takahashi , et al. January 30, 2	2007-01-30
Probe card, method of manufacturing the probe card and alignment method App 20060132155 - Yamada; Kenji ; et al.	2006-06-22
Semiconductor wafer and testing method therefor App 20060103408 - Takahashi; Masao ; et al.	2006-05-18
Semiconductor wafer package, method and apparatus for connecting testing IC terminals of semiconductor wafer and probe terminals, testing method of a semiconductor integrated circuit, probe card and its manufacturing method Grant 6,323,663 - Nakata , et al. November 27, 2	2001-11-27
Semiconductor wafer package, method and apparatus for connecting testing IC terminals of semiconductor wafer and probe terminals, testing method of a semiconductor integrated circuit, probe card and its manufacturing method Grant 6,005,401 - Nakata , et al. December 21, 1	1999-12-21
Semiconductor wafer package, method and apparatus for connecting testing IC terminals of semiconductor wafer and probe terminals, testing method of a semiconductor integrated circuit, probe card and its manufacturing method Grant 5,945,834 - Nakata , et al. August 31, 1	1999-08-31

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