Nakata; Yasukazu

Patent Applications and Registrations

Patent applications and USPTO patent grants for Nakata; Yasukazu.The latest application filed is for "adhesive composition and adhesive sheet".

Company Profile

1.13.16

Nakata; Yasukazu - Tokyo JP
Nakata; Yasukazu - Matsudo JP
Nakata; Yasukazu - Chiba JP
Nakata, Yasukazu - Matsudo-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Adhesive composition and adhesive sheet Grant 10,174,234 - Hatanaka , et al. J	2019-01-08
Adhesive Composition And Adhesive Sheet App 20170107410 - HATANAKA; Tomio ; et al.	2017-04-20
Organic Luminescent Material, Method For Producing Organic Luminescent Material And Organic Luminescent Element App 20150228906 - Taneda; Masatsugu ; et al.	2015-08-13
Organic EL element and method for manufacturing same Grant 8,952,371 - Nakata , et al. February 10, 2	2015-02-10
Phosphorescent Material, Process For Producing Phosphorescent Material, And Phosphorescent Element App 20130328038 - Taneda; Masatsugu ; et al.	2013-12-12
Organic El Element And Method For Manufacturing Same App 20130277665 - Nakata; Manabu ; et al.	2013-10-24
Light transmissible solar cell module, process for manufacturing same, and solar cell panel thereof Grant 7,812,248 - Katoh , et al. October 12, 2	2010-10-12
Light transmissible solar cell module, process for manufacturing same, and solar cell panel thereof Grant 7,804,021 - Katoh , et al. September 28, 2	2010-09-28
Light Transmissible Solar Cell Module, Process for Manufacturing Same, and Solar Cell Panel Thereof App 20100101629 - Katoh; Kazuya ; et al.	2010-04-29
Antenna circuit, IC inlet and IC tag Grant 7,626,548 - Matsushita , et al. December 1, 2	2009-12-01
Light Transmissible Solar Cell Module, Process For Manufacturing Same, And Solar Cell Panel Thereof App 20080203965 - Katoh; Kazuya ; et al.	2008-08-28
Flip chip mounting substrate Grant 7,397,672 - Nakata , et al. July 8, 2	2008-07-08
Antenna Circuit, Ic Inlet and Ic Tag App 20080036677 - Matsushita; Taiga ; et al.	2008-02-14
IC tag Grant 7,294,917 - Matsushita , et al. November 13, 2	2007-11-13
Flip chip mounting substrate App 20060201703 - Nakata; Yasukazu ; et al.	2006-09-14
Ic tag App 20060139174 - Matsushita; Taiga ; et al.	2006-06-29
Process for producing semiconductor device and semiconductor device Grant 6,927,099 - Nakata , et al. August 9, 2	2005-08-09
Flat coil component, characteristic adjusting method of flat coil component, ID tag, and characteristic adjusting method of ID tag Grant 6,853,286 - Nikawa , et al. February 8, 2	2005-02-08
Process for producing semiconductor device and semiconductor device App 20050009241 - Nakata, Yasukazu ; et al.	2005-01-13
Reinforcement material for silicon wafer and process for producing IC chip using said material Grant 6,765,289 - Nakata , et al. July 20, 2	2004-07-20
Flat coil component, characteristic adjusting method of flat coil component, ID tag, and characteristic adjusting method of ID tag App 20020183022 - Nikawa, Yoshio ; et al.	2002-12-05
Sheet antenna Grant 6,369,773 - Kashiwagi , et al. April 9, 2	2002-04-09
Reinforcement material for silicone wafer and process for producing IC chip using said material App 20020031863 - Nakata, Yasukazu ; et al.	2002-03-14
Sheet antenna App 20010015700 - Kashiwagi, Kenichi ; et al.	2001-08-23
Adhesive composition and adhesive sheet Grant 6,277,481 - Sugino , et al. August 21, 2	2001-08-21
Process for producing an IC chip having a protective layer App 20010011575 - Nakata, Yasukazu ; et al.	2001-08-09

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