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name:-0.0055768489837646
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Nakashima; Hisataka Patent Filings

Nakashima; Hisataka

Patent Applications and Registrations

Patent applications and USPTO patent grants for Nakashima; Hisataka.The latest application filed is for "bonded composite of silicone resin and epoxy resin and a method for manufacturing thereof".

Company Profile
0.5.5
  • Nakashima; Hisataka - Shizuoka Prefecture JP
  • Nakashima; Hisataka - Chiba JP
  • Nakashima; Hisataka - Chiba Prefecture JP
  • Nakashima; Hisataka - Ichihara JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Acryloxy-functional silicone composition curable by high-energy radiation
Grant 8,178,613 - Nakashima , et al. May 15, 2
2012-05-15
Additional-curable organopolysiloxane resin composition and an optical material
Grant 7,625,986 - Yoshitake , et al. December 1, 2
2009-12-01
Integrally Molded Body of Silicone Resin and Silicone Rubber, Method of Manufacture, and Curable Silicone Resin Composition
App 20080255304 - Nakashima; Hisataka ;   et al.
2008-10-16
Bonded Composite of Silicone Resin and Epoxy Resin and a Method For Manufacturing Thereof
App 20080255321 - Nakashima; Hisataka ;   et al.
2008-10-16
Additional-Curable Organopolysiloxane Resin Composition and an Optical Material
App 20080033120 - Yoshitake; Makoto ;   et al.
2008-02-07
Straight-oil finishing composition and fiber yarn treated therewith
Grant 7,309,726 - Wakita , et al. December 18, 2
2007-12-18
Acryloxy-functional silicone composition curable by high-energy radiation
App 20070032587 - Nakashima; Hisataka ;   et al.
2007-02-08
Straight-oil finishing composition and fiber yarn treated therewith
App 20060163523 - Wakita; Mari ;   et al.
2006-07-27
Silicone modified polyimide resin and method for preparing same
Grant 5,262,505 - Nakashima , et al. November 16, 1
1993-11-16
Phenylpolysilsesquioxanes and method for their preparation
Grant 5,247,043 - Nakashima September 21, 1
1993-09-21

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