NAKASHIMA; Daiki

Patent Applications and Registrations

Patent applications and USPTO patent grants for NAKASHIMA; Daiki.The latest application filed is for "virtual-bond collecting device, computer readable medium and virtual-bond collecting method".

Company Profile

0.4.8

NAKASHIMA; Daiki - Tokyo JP
Nakashima; Daiki - Itami-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Virtual-bond Collecting Device, Computer Readable Medium And Virtual-bond Collecting Method App 20220101431 - MATSUMOTO; Mitsuhiro ; et al.	2022-03-31
Modified Natural Rubber, Rubber Composition Using Same, And Method For Producing Modified Natural Rubber App 20210269557 - Nakashima; Daiki ; et al.	2021-09-02
Modified Natural Rubber, Rubber Composition Using The Rubber, And Pneumatic Tire Using The Composition App 20210179824 - Nakashima; Daiki	2021-06-17
Semiconductor device having electrical fuse and control method thereof Grant 9,543,037 - Kubouchi , et al. January 10, 2	2017-01-10
Semiconductor Device And Method Of Adjusting Characteristic Thereof App 20140225640 - Kuroki; Koji ; et al.	2014-08-14
Semiconductor device and method of adjusting characteristic thereof Grant 8,710,861 - Kuroki , et al. April 29, 2	2014-04-29
Semiconductor Device Having Electrical Fuse And Control Method Thereof App 20120120735 - KUBOUCHI; Shuichi ; et al.	2012-05-17
Semiconductor Device Having Electrical Fuse And Control Method Thereof App 20120120750 - KUBOUCHI; Shuichi ; et al.	2012-05-17
Semiconductor device and method of adjusting characteristic thereof App 20120056641 - Kuroki; Koji ; et al.	2012-03-08

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