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Nakao; Seiichiro Patent Filings

Nakao; Seiichiro

Patent Applications and Registrations

Patent applications and USPTO patent grants for Nakao; Seiichiro.The latest application filed is for "plating solution for threaded connection for pipe or tube and producing method of threaded connection for pipe or tube".

Company Profile
1.5.5
  • Nakao; Seiichiro - Akashi JP
  • NAKAO; Seiichiro - Akashi-shi Hyogo
  • Nakao; Seiichiro - Kobe JP
  • Nakao; Seiichiro - Hyogo-ken JP
  • Nakao, Seiichiro - Kobe-shi JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Plating solution for threaded connection for pipe or tube and producing method of threaded connection for pipe or tube
Grant 10,370,770 - Kimoto , et al.
2019-08-06
Plating Solution For Threaded Connection For Pipe Or Tube And Producing Method Of Threaded Connection For Pipe Or Tube
App 20170051421 - KIMOTO; Masanari ;   et al.
2017-02-23
Plating Solution For Threaded Connection For Pipe Or Tube And Producing Method Of Threaded Connection For Pipe Or Tube
App 20170051422 - KIMOTO; Masanari ;   et al.
2017-02-23
Pretreatment solution for providing catalyst for electroless plating, pretreatment method using the solution, and electroless plated film and/or plated object produced by use of the method
Grant 7,166,152 - Okuhama , et al. January 23, 2
2007-01-23
Method for forming circuit pattern
Grant 7,056,448 - Okuhama , et al. June 6, 2
2006-06-06
Method for forming circuit pattern
App 20050258134 - Okuhama, Yoshiaki ;   et al.
2005-11-24
Plating method and plating bath precursor used therefor
Grant 6,852,210 - Obata , et al. February 8, 2
2005-02-08
Pretreatment solution for providing catalyst for electroless plating, pretreatment method using the solution, and electroless plated film and/or plated object produced by use of the method
App 20040043153 - Okuhama, Yoshiaki ;   et al.
2004-03-04
Plating method and plating bath precursor used therefor
App 20020079226 - Obata, Keigo ;   et al.
2002-06-27
Redox system electroless plating method
Grant 6,338,787 - Obata , et al. January 15, 2
2002-01-15

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