Nakao; Morio
Patent Applications and Registrations
Patent applications and USPTO patent grants for Nakao; Morio.The latest application filed is for "printed wiring board".
- Nakao; Morio - Shinjuku-ku JP
- Nakao, Morio - Hiji-Machi JP
- Nakao; Morio - Hayami-Gun JP
| Patent | Date |
|---|---|
| Printed wiring board having a solder pad and a method for manufacturing the same Grant 7,568,922 - Yamashita , et al. August 4, 2 | 2009-08-04 |
| Printed wiring board App 20060169484 - Yamashita; Takahiro ; et al. | 2006-08-03 |
| High reliability chip scale package App 20050023682 - Nakao, Morio | 2005-02-03 |
| Semiconductor device package with integrated heatspreader App 20040036172 - Azuma, Chikara ; et al. | 2004-02-26 |
| Electronic component mounting base board having heat slug with slits and projections Grant 6,232,558 - Tsukada , et al. May 15, 2 | 2001-05-15 |
| Electronic component mounting base board and method of producing the same Grant 5,914,859 - Takada , et al. June 22, 1 | 1999-06-22 |
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