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name:-0.0018191337585449
Nakao; Keiichi Patent Filings

Nakao; Keiichi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Nakao; Keiichi.The latest application filed is for "vehicular hydraulic control device and vehicular hydraulic control method".

Company Profile
1.24.19
  • Nakao; Keiichi - Kanagawa JP
  • Nakao; Keiichi - Osaka N/A JP
  • Nakao; Keiichi - Hirakata JP
  • Nakao, Keiichi - Hirakata-shi JP
  • Nakao, Keiichi - Hirakata-shi Osaka JP
  • Nakao; Keiichi - Kyoto JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Vehicular hydraulic control device and vehicular hydraulic control method
Grant 10,309,528 - Katakura , et al.
2019-06-04
Vehicular Hydraulic Control Device And Vehicular Hydraulic Control Method
App 20180094722 - KATAKURA; Shusaku ;   et al.
2018-04-05
Combination of base layer and ink for inkjet for manufacturing electronic component
Grant 8,507,076 - Nakao , et al. August 13, 2
2013-08-13
Magnet Roll
App 20130149012 - Nakao; Keiichi ;   et al.
2013-06-13
Method of manufacturing base layer, ink for inkjet and electronic components
Grant 8,247,474 - Nakao , et al. August 21, 2
2012-08-21
Base layer for manufacturing an electronic component by an etching process
Grant 8,178,188 - Nakao , et al. May 15, 2
2012-05-15
Heat dissipating structure base board, module using heat dissipating structure base board, and method for manufacturing heat dissipating structure base board
Grant 8,130,499 - Ohnishi , et al. March 6, 2
2012-03-06
Combination Of Base Layer And Ink For Inkjet For Manufacturing Electronic Component
App 20110293901 - NAKAO; Keiichi ;   et al.
2011-12-01
Method Of Manufacturing Base Layer, Ink For Inkjet And Electronic Components
App 20110205286 - NAKAO; Keiichi ;   et al.
2011-08-25
Method Of Manufacturing Base Layer, Ink For Inkjet And Electronic Components
App 20110203482 - NAKAO; Keiichi ;   et al.
2011-08-25
Strain sensor and method for manufacture thereof
Grant 7,882,747 - Nakao , et al. February 8, 2
2011-02-08
Heat Dissipating Structure Base Board, Module Using Heat Dissipating Structure Base Board, And Method For Manufacturing Heat Dissipating Structure Base Board
App 20100091464 - Ohnishi; Tohru ;   et al.
2010-04-15
Method Of Manufacturing Base Layer, Ink For Inkjet And Electronic Components
App 20090104384 - NAKAO; Keiichi ;   et al.
2009-04-23
Strain Sensor and Method for Manufacture Thereof
App 20080233370 - Nakao; Keiichi ;   et al.
2008-09-25
Load sensor and its manufacturing method
Grant 7,397,340 - Nakao , et al. July 8, 2
2008-07-08
Method of manufacturing strain sensor
Grant 7,181,831 - Nakao , et al. February 27, 2
2007-02-27
Load sensor and method of manufacturing the load sensor, paste used for the method, and method of manufacturing the paste
Grant 7,164,342 - Nakao , et al. January 16, 2
2007-01-16
Ink jet device, ink jet ink, and method of manufacturing electronic component using the device and the ink
Grant 7,097,287 - Nakao , et al. August 29, 2
2006-08-29
Strain sensor and production method therefor
Grant 7,043,996 - Mizukami , et al. May 16, 2
2006-05-16
Strain sensor and method of producing the same
Grant 7,010,986 - Nakao , et al. March 14, 2
2006-03-14
Load sensor and its manufacturing method
App 20060001521 - Nakao; Keiichi ;   et al.
2006-01-05
Method of forming an electronic component using ink
Grant 6,979,416 - Nakao , et al. December 27, 2
2005-12-27
Method of manufacturing electronic component and member to be used in the same method
App 20050126002 - Nakao, Keiichi
2005-06-16
Method of manufacturing electronic component and member to be used in the same method
App 20050126003 - Nakao, Keiichi
2005-06-16
Load sensor and method of manufacturing the load sensor, paste used for the method, and method of manufacturing the paste
App 20050085393 - Nakao, Keiichi ;   et al.
2005-04-21
Method of producing electronic parts, and member for production thereof
Grant 6,855,367 - Nakao February 15, 2
2005-02-15
Strain sensor and method of producing the same
App 20050028605 - Nakao, Keiichi ;   et al.
2005-02-10
Strain sensor and production method therefor
App 20040216529 - Mizukami, Yukio ;   et al.
2004-11-04
Method for manufacturing ceramic multi-layered board
Grant 6,811,634 - Hashimoto , et al. November 2, 2
2004-11-02
Strain sensor and method of producing the same
App 20040079162 - Nakao, Keiichi ;   et al.
2004-04-29
Ink jet device, ink jet ink, and method of manufacturing electronic component using the device and the ink
App 20040061747 - Nakao, Keiichi ;   et al.
2004-04-01
Method for manufacturing ceramic multilayered board
App 20030183318 - Hashimoto, Akira ;   et al.
2003-10-02
Method of producing electronic parts, and member for production thereof
App 20030167634 - Nakao, Keiichi
2003-09-11
Method of forming an electronic component using ink
App 20030063155 - Nakao, Keiichi ;   et al.
2003-04-03
Method for manufacturing laminated-ceramic electronic components
Grant 6,485,591 - Nakao , et al. November 26, 2
2002-11-26
Electronic part fabricated by intaglio printing and a method for fabricating the same
Grant 6,378,424 - Hayama , et al. April 30, 2
2002-04-30
Method of producing a chip resistor
Grant 6,314,637 - Kimura , et al. November 13, 2
2001-11-13
Electronic part fabricated by intaglio printing
Grant 6,310,304 - Hayama , et al. October 30, 2
2001-10-30
Electric double-layer capacitor and method for manufacturing the same
Grant 6,246,568 - Nakao , et al. June 12, 2
2001-06-12
Chip resistor
Grant 5,907,274 - Kimura , et al. May 25, 1
1999-05-25
Method for fabricating an electronic part by intaglio printing
Grant 5,609,704 - Hayama , et al. March 11, 1
1997-03-11
Method of producing a ceramic electronic device
Grant 5,599,413 - Nakao , et al. February 4, 1
1997-02-04

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