Nakano; Masatake

Patent Applications and Registrations

Patent applications and USPTO patent grants for Nakano; Masatake.The latest application filed is for "method for producing bonded soi wafer".

Company Profile

1.19.13

Nakano; Masatake - Annaka JP
NAKANO; Masatake - Annaka-shi JP
Nakano; Masatake - Higashihiroshima JP
NAKANO; Masatake - Higashihiroshima-shi JP
Nakano; Masatake - Gunma JP
Nakano; Masatake - Hiroshima JP
Nakano, Masatake - Annaka-shi Gunma JP
Nakano; Masatake - Gunma-ken JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method for producing bonded SOI wafer Grant 11,056,381 - Ishizuka , et al. July 6, 2	2021-07-06
Method for manufacturing a bonded SOI wafer Grant 10,460,983 - Wakabayashi , et al. Oc	2019-10-29
Method for manufacturing a bonded SOI wafer Grant 10,424,484 - Ishizuka , et al. Sept	2019-09-24
Method For Producing Bonded Soi Wafer App 20180247860 - ISHIZUKA; Toru ; et al.	2018-08-30
Method For Manufacturing A Bonded Soi Wafer App 20170345663 - ISHIZUKA; Toru ; et al.	2017-11-30
Method For Manufacturing A Bonded Soi Wafer App 20170040210 - WAKABAYASHI; Taishi ; et al.	2017-02-09
SOI wafer, semiconductor device, and method for manufacturing SOI wafer Grant 8,466,538 - Ishizuka , et al. June 18, 2	2013-06-18
Soi Wafer, Semiconductor Device, And Method For Manufacturing Soi Wafer App 20100314722 - Ishizuka; Tohru ; et al.	2010-12-16
Portable information processing apparatus Grant 7,565,186 - Okuzako , et al. July 21, 2	2009-07-21
Method of fabricating bonded wafer Grant 7,531,425 - Nakano , et al. May 12, 2	2009-05-12
Portable Information Processing Apparatus App 20080220821 - OKUZAKO; Kazutaka ; et al.	2008-09-11
Portable information processing apparatus Grant 7,359,740 - Okuzako , et al. April 15, 2	2008-04-15
Method of manufacturing an SOI wafer where COP's are eliminated within the base wafer Grant 7,186,628 - Nakano March 6, 2	2007-03-06
Mobile telephone device App 20060152600 - Hamada; Hiroaki ; et al.	2006-07-13
Production method for bonded substrates Grant 6,959,854 - Yokokawa , et al. November 1, 2	2005-11-01
Method for producing bonded wafer and bonded wafer Grant 6,900,113 - Nakano , et al. May 31, 2	2005-05-31
Soi wafer manufacturing method and soi wafer App 20050032331 - Nakano, Masatake	2005-02-10
Production method for silicon wafer and soi wafer, and soi wafer App 20050020030 - Nakano, Masatake ; et al.	2005-01-27
Bonded wafer producing method and bonded wafer Grant 6,797,632 - Nakano , et al. September 28, 2	2004-09-28
Portable information processing apparatus App 20040116167 - Okuzako, Kazutaka ; et al.	2004-06-17
Method for reclaiming delaminated wafer and reclaimed delaminated wafer Grant 6,720,640 - Kuwabara , et al. April 13, 2	2004-04-13
Production method for bonded substrates App 20040035525 - Yokokawa, Isao ; et al.	2004-02-26
Method for reclaiming delaminated wafer and reclaimed delaminated wafer App 20030219957 - Kuwabara, Susumu ; et al.	2003-11-27
Method for producing bonded wafer and bonded wafer App 20030153162 - Nakano, Masatake ; et al.	2003-08-14
Method for reclaiming delaminated wafer and reclaimed delaminated wafer Grant 6,596,610 - Kuwabara , et al. July 22, 2	2003-07-22
Method for manufacturing SOI wafer including heat treatment in an oxidizing atmosphere Grant 6,534,384 - Nakano , et al. March 18, 2	2003-03-18
Methods For Manufacturing Soi Wafer And Soi Wafer App 20010055863 - NAKANO, MASATAKE ; et al.	2001-12-27
Method of forming oxide film on an SOI layer and method of fabricating a bonded wafer Grant 6,239,004 - Aga , et al. May 29, 2	2001-05-29
Method for manufacturing bonded wafer and bonded wafer manufactured thereby Grant 6,004,866 - Nakano , et al. December 21, 1	1999-12-21
Method and apparatus for production of extremely thin SOI film substrate Grant 5,427,052 - Ohta , et al. * June 27, 1	1995-06-27
Method of fabricating SOI substrate with uniform thin silicon film Grant 5,240,883 - Abe , et al. August 31, 1	1993-08-31

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