loadpatents
name:-0.031816005706787
name:-0.037001848220825
name:-0.018679857254028
Nakano; Eiichi Patent Filings

Nakano; Eiichi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Nakano; Eiichi.The latest application filed is for "anisotropic conductive film with carbon-based conductive regions and related semiconductor device assemblies and methods".

Company Profile
19.34.28
  • Nakano; Eiichi - Boise ID
  • Nakano; Eiichi - Kawasaki JP
  • NAKANO; EIICHI - KAWASAKI-SHI JP
  • Nakano; Eiichi - Saitama JP
  • Nakano, Eiichi - Tokyo JP
  • Nakano; Eiichi - Noda JP
  • Nakano; Eiichi - Iwatsuki JP
  • Nakano; Eiichi - Wakayama JP
  • Nakano; Eiichi - Sattemachi JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Methods for fabricating 3D semiconductor device packages, resulting packages and systems incorporating such packages
Grant 11,456,278 - Nakano September 27, 2
2022-09-27
Semiconductor dice assemblies, packages and systems, and methods of operation
Grant 11,380,665 - Nakano , et al. July 5, 2
2022-07-05
Anisotropic Conductive Film With Carbon-based Conductive Regions And Related Semiconductor Device Assemblies And Methods
App 20220077098 - Nakano; Eiichi ;   et al.
2022-03-10
Semiconductor Assemblies Including Thermal Circuits And Methods Of Manufacturing The Same
App 20220059508 - Yoo; Chan H. ;   et al.
2022-02-24
Use Of Pre-channeled Materials For Anisotropic Conductors
App 20220028820 - Tuttle; Mark E. ;   et al.
2022-01-27
Thermal Management Of Gpu-hbm Package By Microchannel Integrated Substrate
App 20210407889 - Qu; Xiaopeng ;   et al.
2021-12-30
Anisotropic conductive film with carbon-based conductive regions and related semiconductor assemblies, systems, and methods
Grant 11,189,588 - Nakano , et al. November 30, 2
2021-11-30
Semiconductor assemblies including thermal circuits and methods of manufacturing the same
Grant 11,171,118 - Yoo , et al. November 9, 2
2021-11-09
Use of pre-channeled materials for anisotropic conductors
Grant 11,139,262 - Tuttle , et al. October 5, 2
2021-10-05
Thermal Management Materials For Semiconductor Devices, And Associated Systems And Methods
App 20210272872 - Qu; Xiaopeng ;   et al.
2021-09-02
Wafer-scale Memory Techniques
App 20210240344 - Keeth; Brent ;   et al.
2021-08-05
Semiconductor devices having electrically and optically conductive vias, and associated systems and methods
Grant 11,069,612 - Nakano , et al. July 20, 2
2021-07-20
Microelectronic Device Assemblies And Packages And Related Methods And Systems
App 20210118852 - Fay; Owen R. ;   et al.
2021-04-22
Semiconductor device with flexible circuit for enabling non-destructive attaching and detaching of device to system board
Grant 10,943,860 - Yoo , et al. March 9, 2
2021-03-09
Device Packages Including Redistribution Layers With Carbon-based Conductive Elements, And Methods Of Fabrication
App 20210057342 - Nakano; Eiichi
2021-02-25
Semiconductor Assemblies Including Thermal Circuits And Methods Of Manufacturing The Same
App 20210005575 - Yoo; Chan H. ;   et al.
2021-01-07
Redistribution layers with carbon-based conductive elements, methods of fabrication and related semiconductor device packages and systems
Grant 10,854,549 - Nakano December 1, 2
2020-12-01
Methods for fabricating 3D semiconductor device packages, resulting packages and systems incorporating such packages
Grant 10,797,018 - Nakano October 6, 2
2020-10-06
Methods For Fabricating 3d Semiconductor Device Packages, Resulting Packages And Systems Incorporating Such Packages
App 20200266173 - Nakano; Eiichi
2020-08-20
Use of Pre-Channeled Materials for Anisotropic Conductors
App 20200258859 - A1
2020-08-13
Anisotropic Conductive Film With Carbon-based Conductive Regions And Related Semiconductor Assemblies, Systems, And Methods
App 20200211996 - Nakano; Eiichi ;   et al.
2020-07-02
Redistribution Layers With Carbon-based Conductive Elements, Methods Of Fabrication And Related Semiconductor Device Packages An
App 20200211967 - Nakano; Eiichi
2020-07-02
Semiconductor device packages and structures
Grant 10,651,050 - Nakano
2020-05-12
Semiconductor Devices Having Electrically And Optically Conductive Vias, And Associated Systems And Methods
App 20200126907 - Nakano; Eiichi ;   et al.
2020-04-23
Semiconductor dice assemblies, packages and systems, and methods of operation
Grant 10,600,770 - Nakano , et al.
2020-03-24
Silicon interposer with fuse-selectable routing array
Grant 10,580,720 - Street , et al.
2020-03-03
Semiconductor devices having electrically and optically conductive vias, and associated systems and methods
Grant 10,529,659 - Nakano , et al. J
2020-01-07
Semiconductor Dice Assemblies, Packages And Systems, And Methods Of Operation
App 20190385996 - Nakano; Eiichi ;   et al.
2019-12-19
Methods For Fabricating 3d Semiconductor Device Packages, Resulting Packages And Systems Incorporating Such Packages
App 20190348394 - Nakano; Eiichi
2019-11-14
Semiconductor Dice Assemblies, Packages And Systems, And Methods Of Operation
App 20190348406 - Nakano; Eiichi ;   et al.
2019-11-14
Stacked semiconductor dies including inductors and associated methods
Grant 10,446,527 - Nakano Oc
2019-10-15
Semiconductor device packages and related methods
Grant 10,418,255 - Nakano Sept
2019-09-17
Semiconductor Device Packages And Structures
App 20190273000 - Nakano; Eiichi
2019-09-05
Semiconductor Device with Flexible Circuit for Enabling Non-destructive Attaching and Detaching of Device to System Board
App 20190214331 - Yoo; Chan H. ;   et al.
2019-07-11
Semiconductor Devices Having Electrically And Optically Conductive Vias, And Associated Systems And Methods
App 20190198443 - Nakano; Eiichi ;   et al.
2019-06-27
Methods for fabricating 3D semiconductor device packages, resulting packages and systems incorporating such packages
Grant 10,319,696 - Nakano
2019-06-11
Semiconductor Device Packages And Related Methods
App 20190172724 - Nakano; Eiichi
2019-06-06
Semiconductor device with flexible circuit for enabling non-destructive attaching and detaching of device to system board
Grant 10,276,487 - Yoo , et al.
2019-04-30
Semiconductor Device With Flexible Circuit For Enabling Non-destructive Attaching And Detaching Of Device To System Board
App 20190115286 - Yoo; Chan H. ;   et al.
2019-04-18
Stacked Semiconductor Dies Including Inductors And Associated Methods
App 20190067253 - Nakano; Eiichi
2019-02-28
Stacked semiconductor dies including inductors and associated methods
Grant 10,217,726 - Nakano Feb
2019-02-26
Semiconductor devices having electrically and optically conductive vias, and associated systems and methods
Grant 10,141,259 - Nakano , et al. Nov
2018-11-27
Method of producing L-lysine
Grant 8,183,017 - Otsuna , et al. May 22, 2
2012-05-22
Method Of Producing L-lysine
App 20110065153 - OTSUNA; SEIKO ;   et al.
2011-03-17
Method of producing L-lysine
Grant 7,846,698 - Otsuna , et al. December 7, 2
2010-12-07
Method of producing L-lysine
App 20030054506 - Otsuna, Seiko ;   et al.
2003-03-20
Luminescent tool, its auxiliary member and method of preserving bioluminescent composition used in the tool and the auxiliary member
Grant 6,521,304 - Kajiyama , et al. February 18, 2
2003-02-18
Method Of Producing L-lysine
App 20020086370 - OTSUNA, SEIKO ;   et al.
2002-07-04
Calculation service providing system
App 20010049735 - Nakano, Eiichi ;   et al.
2001-12-06
Variant E1 protein gene for pyruvate dehydrogenase complex and variant E1 protein of pyruvate dehydrogenase complex
Grant 5,432,071 - Ichikawa , et al. July 11, 1
1995-07-11
Purified luciferase from luciola lateralis
Grant 5,352,598 - Kajiyama , et al. October 4, 1
1994-10-04
Mutant luciferase of a firefly
Grant 5,330,906 - Kajiyama , et al. July 19, 1
1994-07-19
Thermostable luciferase of firefly, thermostable luciferase gene of firefly, novel recombinant DNA, and process for the preparation of thermostable luciferase of firefly
Grant 5,229,285 - Kajiyama , et al. July 20, 1
1993-07-20
Mutant luciferase of a firefly, mutant luciferase genes, recombinant DNAS containing the genes and a method of producing mutant luciferase
Grant 5,219,737 - Kajiyama , et al. June 15, 1
1993-06-15
Purified luciferase from luciola cruciata
Grant 5,182,202 - Kajiyama , et al. January 26, 1
1993-01-26
Method for decolorization of waste water
Grant 5,180,497 - Sando , et al. January 19, 1
1993-01-19
Luciferase gene and novel recombinant DNA as well as a method of producing luciferase
Grant 4,968,613 - Masuda , et al. November 6, 1
1990-11-06
Novel bacteriophage and method for breeding thereof
Grant 4,865,979 - Nakano , et al. September 12, 1
1989-09-12
Method for preparing a recombinant DNA phage
Grant 4,348,477 - Nakano , et al. * September 7, 1
1982-09-07
Method for preparation of a recombinant DNA phage
Grant 4,348,478 - Nakano , et al. * September 7, 1
1982-09-07
Novel bacteriophage and method for preparing same
Grant 4,332,897 - Nakano , et al. June 1, 1
1982-06-01

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