Nakano; Akinori

Patent Applications and Registrations

Patent applications and USPTO patent grants for Nakano; Akinori.The latest application filed is for "substrate processing method and apparatus".

Company Profile

2.12.14

Nakano; Akinori - Tokyo JP
Nakano; Akinori - Kobe JP
Nakano; Akinori - Ota-ku NL
Nakano; Akinori - Tama-shi JP
Nakano; Akinori - Tama JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Substrate Processing Method And Apparatus App 20190259611 - Nakano; Akinori ; et al.	2019-08-22
Microphone with built-in speaker Grant D851,633 - Nakano , et al.	2019-06-18
Method for protecting layer by forming hydrocarbon-based extremely thin film Grant 9,899,291 - Kato , et al. February 20, 2	2018-02-20
Method For Protecting Layer By Forming Hydrocarbon-based Extremely Thin Film App 20170018477 - Kato; Richika ; et al.	2017-01-19
Method for hydrophobization of surface of silicon-containing film by ALD Grant 9,478,414 - Kobayashi , et al. October 25, 2	2016-10-25
Method for Hydrophobization of Surface of Silicon-Containing Film by ALD App 20160093485 - Kobayashi; Akiko ; et al.	2016-03-31
Method for forming SiOCH film using organoaminosilane annealing Grant 9,190,263 - Ishikawa , et al. November 17, 2	2015-11-17
Method for filling recesses using pre-treatment with hydrocarbon-containing gas Grant 9,117,657 - Nakano , et al. August 25, 2	2015-08-25
Method for treating SiOCH film with hydrogen plasma Grant 9,029,272 - Nakano , et al. May 12, 2	2015-05-12
Method for Treating SiOCH Film With Hydrogen Plasma App 20150118864 - Nakano; Akinori ; et al.	2015-04-30
Method for Forming SiOCH Film Using Organoaminosilane Annealing App 20150056821 - Ishikawa; Dai ; et al.	2015-02-26
Method For Filling Recesses Using Pre-Treatment With Hydrocarbon-Containing Gas App 20140363983 - Nakano; Akinori ; et al.	2014-12-11
Method for reducing dielectric constant of film using direct plasma of hydrogen Grant 8,551,892 - Nakano October 8, 2	2013-10-08
Method For Reducing Dielectric Constant Of Film Using Direct Plasma Of Hydrogen App 20130029498 - Nakano; Akinori	2013-01-31
Liner materials and related processes for 3-D integration Grant 7,884,016 - Sprey , et al. February 8, 2	2011-02-08
Liner Materials And Related Processes For 3-d Integration App 20100200989 - Sprey; Hessel ; et al.	2010-08-12
Method Of Forming Low-k Film Having Chemical Resistance App 20100151151 - Matsushita; Kiyohiro ; et al.	2010-06-17
Method Of Forming Fluorine-containing Dielectric Film App 20100003833 - Tsuji; Naoto ; et al.	2010-01-07
Copolymerized high polymer film and method of manufacturing the same Grant 7,524,908 - Kawahara , et al. April 28, 2	2009-04-28
Polymer film and method for producing the same Grant 7,439,315 - Kunimi , et al. October 21, 2	2008-10-21
Polymer film and method for producing the same Grant 7,220,810 - Kunimi , et al. May 22, 2	2007-05-22
Polymer film and method for producing the same App 20060052560 - Kunimi; Nobutaka ; et al.	2006-03-09
Polymer film and method for producing the same App 20060009600 - Kunimi; Nobutaka ; et al.	2006-01-12
Copolymerized high polymer film and method of manufacturing the same App 20050282987 - Kawahara, Jun ; et al.	2005-12-22

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