Nakanishi; Keiichirou

Patent Applications and Registrations

Patent applications and USPTO patent grants for Nakanishi; Keiichirou.The latest application filed is for "integrated circuit device having different signal transfer circuits for wirings with different lengths".

Company Profile

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Nakanishi; Keiichirou - Tokyo JP
Nakanishi; Keiichirou - Kokubunji JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Integrated circuit device having different signal transfer circuits for wirings with different lengths Grant 5,521,536 - Yamashita , et al. May 28, 1	1996-05-28
Semiconductor integrated circuit device and computer system using the same Grant 5,434,453 - Yamamoto , et al. July 18, 1	1995-07-18
Semiconductor integrated circuit device having a signal transmission line pair interconnected by propagation delay time control resistance Grant 5,214,318 - Nakanishi , et al. May 25, 1	1993-05-25
Integrated circuit device having an ic chip mounted on the wiring substrate and having suitable mutual connections between internal circuits Grant 5,212,403 - Nakanishi , et al. May 18, 1	1993-05-18
Capacitor-carrying semiconductor module Grant 5,177,670 - Shinohara , et al. January 5, 1	1993-01-05
Thick film and thin film composite substrate and electronic circuit apparatus using it Grant 5,110,664 - Nakanishi , et al. May 5, 1	1992-05-05
Chip carrier Grant 4,954,877 - Nakanishi , et al. September 4, 1	1990-09-04
Integrated circuit chips cooling module having coolant leakage prevention device Grant 4,870,477 - Nakanishi , et al. September 26, 1	1989-09-26
Integrated circuit device Grant 4,809,058 - Funamoto , et al. February 28, 1	1989-02-28
Hybrid multilayer wiring board Grant 4,710,854 - Yamada , et al. December 1, 1	1987-12-01
Device for cooling integrated circuit chip Grant 4,686,606 - Yamada , et al. August 11, 1	1987-08-11
Cooling module for integrated circuit chips Grant 4,644,385 - Nakanishi , et al. February 17, 1	1987-02-17
Cooling module for integrated circuit chips Grant 4,558,395 - Yamada , et al. December 10, 1	1985-12-10

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