Nakamura; Nakae

Patent Applications and Registrations

Patent applications and USPTO patent grants for Nakamura; Nakae.The latest application filed is for "sensor sheet, sensor sheet module, touch sensor panel module, and electronic equipment".

Company Profile

0.7.6

Nakamura; Nakae - Osaka JP
NAKAMURA; Nakae - Osaka-shi Osaka
Nakamura; Nakae - Fukuyama JP
Nakamura; Nakae - Hiroshima JP
Nakamura, Nakae - Fukuyama-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Sensor sheet, sensor sheet module, touch sensor panel module, and electronic equipment Grant 9,632,609 - Tsukamoto , et al. April 25, 2	2017-04-25
Drive module, display panel, display device, and multi-display device Grant 9,489,908 - Marushima , et al. November 8, 2	2016-11-08
Sensor Sheet, Sensor Sheet Module, Touch Sensor Panel Module, And Electronic Equipment App 20160098111 - TSUKAMOTO; Hiroaki ; et al.	2016-04-07
Touch Panel Module And Electronic Information Equipment App 20160085346 - TSUKAMOTO; Hiroaki ; et al.	2016-03-24
Drive Module, Display Panel, Display Device, And Multi-display Device App 20150302815 - MARUSHIMA; Yoshinari ; et al.	2015-10-22
Connection structure for connecting semiconductor element and wiring board, and semiconductor device Grant 7,420,282 - Iwane , et al. September 2, 2	2008-09-02
Connection structure for connecting semiconductor element and wiring board, and semiconductor device App 20060081999 - Iwane; Tomohiko ; et al.	2006-04-20
Semiconductor device having active element connected to an electrode metal pad via a barrier metal layer and interlayer insulating film Grant 6,864,562 - Toyosawa , et al. March 8, 2	2005-03-08
Semi-conductor apparatus, a method of fabrication of the same, and a reinforcing tape used in fabrication of the same Grant 6,740,966 - Nakamura May 25, 2	2004-05-25
Semiconductor device having active element connected to an electrode metal pad via a barrier metal layer and interlayer insulating film Grant 6,650,002 - Toyosawa , et al. November 18, 2	2003-11-18
Tape carrier, manufacturing method of tape carrier and package manufacturing method Grant 6,624,520 - Nakamura September 23, 2	2003-09-23
A Semiconductor Device Having Active Element Connected To An Electrode Metal Pad Via A Barrier Metal Layer And Interlayer Insulating Film App 20020000659 - TOYOSAWA, KENJI ; et al.	2002-01-03
Semiconductor apparatus, a method of fabrication of the same, and a reinforcing tape used in fabrication of the same App 20010008303 - Nakamura, Nakae	2001-07-19

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