loadpatents
name:-0.0085220336914062
name:-0.0028109550476074
name:-0.0015101432800293
NAKAMURA; Kou Patent Filings

NAKAMURA; Kou

Patent Applications and Registrations

Patent applications and USPTO patent grants for NAKAMURA; Kou.The latest application filed is for "label for in-mold molding and labeled resin molded article".

Company Profile
1.3.8
  • NAKAMURA; Kou - Ibaraki JP
  • Nakamura; Kou - Kawasaki JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Label For In-mold Molding And Labeled Resin Molded Article
App 20200016801 - IKARASHI; Takuya ;   et al.
2020-01-16
Readily Removable Film, Label For In-mold Molding, Molded Resin Article Having Label Attached Thereto, Wallpaper, Glue Label, And Container Having Label Attached Thereto
App 20150375477 - SUZUKI; Tatsuya ;   et al.
2015-12-31
Film And Labeled Plastic Container
App 20150247017 - SUZUKI; Tatsuya ;   et al.
2015-09-03
Readily removable film, label for in-mold molding, molded resin article having label attached thereto, wallpaper, glue label, and container having label attached thereto
Grant 9,102,126 - Suzuki , et al. August 11, 2
2015-08-11
Readily Removable Film, Label For In-mold Molding, Molded Resin Article Having Label Attached Thereto, Wallpaper, Glue Label, And Container Having Label Attached Thereto
App 20130164471 - Suzuki; Tatsuya ;   et al.
2013-06-27
Label For In-mold Molding
App 20120040197 - Suzuki; Tatsuya ;   et al.
2012-02-16
Goods/item Management System And Goods/item Management Method
App 20080186183 - Nagai; Kouichi ;   et al.
2008-08-07
Method for fabricating semiconductor device
Grant 7,029,984 - Horii , et al. April 18, 2
2006-04-18
Method for fabricating semiconductor device
App 20050215006 - Horii, Yoshimasa ;   et al.
2005-09-29

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