Nakamura; Eiji I.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Nakamura; Eiji I..The latest application filed is for "fabrication of solder balls with injection molded solder".
- Nakamura; Eiji I. - Kawasaki JP
- Nakamura; Eiji I - Kawasaki JP
| Patent | Date |
|---|---|
| Fabrication of solder balls with injection molded solder Grant 10,741,514 - Aoki , et al. A | 2020-08-11 |
| Method of forming a solder bump structure Grant 10,692,829 - Aoki , et al. | 2020-06-23 |
| Method of forming a solder bump structure Grant 10,607,956 - Aoki , et al. | 2020-03-31 |
| Reduction of stress in via structure Grant 10,593,616 - Aoki , et al. | 2020-03-17 |
| Fabrication Of Solder Balls With Injection Molded Solder App 20200075522 - Aoki; Toyohiro ; et al. | 2020-03-05 |
| Method Of Forming A Solder Bump Structure App 20200058612 - Aoki; Toyohiro ; et al. | 2020-02-20 |
| Fabrication of solder balls with injection molded solder Grant 10,566,302 - Aoki , et al. Feb | 2020-02-18 |
| Method of forming a solder bump structure Grant 10,553,553 - Aoki , et al. Fe | 2020-02-04 |
| Reduction Of Stress In Via Structure App 20190214339 - Aoki; Toyohiro ; et al. | 2019-07-11 |
| Reduction of stress in via structure Grant 10,325,839 - Aoki , et al. | 2019-06-18 |
| Fabrication of solder balls with injection molded solder Grant 10,103,118 - Aoki , et al. October 16, 2 | 2018-10-16 |
| Reduction Of Stress In Via Structure App 20180294213 - Aoki; Toyohiro ; et al. | 2018-10-11 |
| Reduction Of Stress In Via Structure App 20180294214 - Aoki; Toyohiro ; et al. | 2018-10-11 |
| Fabrication Of Solder Balls With Injection Molded Solder App 20180269173 - Aoki; Toyohiro ; et al. | 2018-09-20 |
| Fabrication of solder balls with injection molded solder Grant 10,037,958 - Aoki , et al. July 31, 2 | 2018-07-31 |
| Method Of Forming A Solder Bump Structure App 20180061797 - Aoki; Toyohiro ; et al. | 2018-03-01 |
| Method Of Forming A Solder Bump Structure App 20180061796 - Aoki; Toyohiro ; et al. | 2018-03-01 |
| Method of forming a solder bump structure Grant 9,859,241 - Aoki , et al. January 2, 2 | 2018-01-02 |
| Fabrication of solder balls with injection molded solder Grant 9,837,367 - Aoki , et al. December 5, 2 | 2017-12-05 |
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