Nakamura Eiji
USPTO Trademark & Patent Filings
Trademark applications and grants for Nakamura Eiji. Nakamura Eiji has 1 trademark applications. The latest application filed is for "a symbol or image mark"
- Company Aliases
- Nakamura, Eiji
- eiji nakamura
- Nakamura; Eiji - Tokyo JP
- NAKAMURA; EIJI - Sakai-shi Osaka
- Nakamura; Eiji - Kanagawa JP
- Nakamura; Eiji - KAWASAKI JP
- Nakamura; Eiji - Kawasaki JP
Trademarks Patents
| Patent Application | Date |
|---|---|
| PREVENTION OF DRIPPING OF MATERIAL FOR MATERIAL INJECTION 20220193805 - 17/690096 Aoki; Toyohiro ; et al. | 2022-06-23 |
| CHEMICAL REACTION NETWORK FOR PROCESSING CONCENTRATION OF CHEMICAL SPECIES 20220064700 - 17/001804 Nakamura; Eiji ; et al. | 2022-03-03 |
| DISPLAY DEVICE 20210263384 - 17/255858 NAKAMURA; EIJI | 2021-08-26 |
| RESIST STRUCTURE FOR FORMING BUMPS 20210242164 - 16/777416 Nakamura; Eiji ; et al. | 2021-08-05 |
| RESTORING A WEARABLE BIOLOGICAL SENSOR 20210145325 - 16/689208 Matsumoto; Keiji ; et al. | 2021-05-20 |
| Forming of bump structure 11,329,018 - 16/661,479 Hisada , et al. May 10, 2 | 2022-05-10 |
| Prevention of dripping of material for material injection 11,298,769 - 16/410,651 Aoki , et al. April 12, 2 | 2022-04-12 |
| Fabrication method of high aspect ratio solder bumping with stud bump and injection molded solder, and flip chip joining with the solder bump 11,181,704 - 16/744,996 Aoki , et al. November 23, 2 | 2021-11-23 |
| Resist structure for forming bumps 11,164,845 - 16/777,416 Nakamura , et al. November 2, 2 | 2021-11-02 |
| Fabrication method of high aspect ratio solder bumping with stud bump and injection molded solder, and flip chip joining with the solder bump 11,112,570 - 16/744,958 Aoki , et al. September 7, 2 | 2021-09-07 |
Mark Image Registration | Serial | Trademark Application Date |
|---|---|
"Symbol/Image" 74095599 |
Symbol/Image 1990-09-07 |
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