Nakakita; Shoji
Patent Applications and Registrations
Patent applications and USPTO patent grants for Nakakita; Shoji.The latest application filed is for "method of manufacturing a multichip package with increased adhesive strength".
- Nakakita; Shoji - Tokyo JP
| Patent | Date |
|---|---|
| Method of manufacturing a multichip package with increased adhesive strength Grant 4,874,721 - Kimura , et al. October 17, 1 | 1989-10-17 |
| Multi-layered substrate having a fine wiring structure for LSI or VLSI circuits Grant 4,569,876 - Nakakita February 11, 1 | 1986-02-11 |
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